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IRLR3110ZPBF PDF预览

IRLR3110ZPBF

更新时间: 2024-09-15 02:53:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管PC
页数 文件大小 规格书
11页 736K
描述
AUTOMOTIVE MOSFET

IRLR3110ZPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, D-PAK, 3 PINReach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:6.88Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:934753
Samacsys Pin Count:3Samacsys Part Category:MOSFET (N-Channel)
Samacsys Package Category:OtherSamacsys Footprint Name:D-PAK (TO-252)
Samacsys Released Date:2018-06-29 15:14:44Is Samacsys:N
Base Number Matches:1

IRLR3110ZPBF 数据手册

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PD - 97175A  
AUTOMOTIVE MOSFET  
IRLR3110ZPbF  
IRLU3110ZPbF  
Features  
HEXFET® Power MOSFET  
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
D
VDSS = 100V  
Repetitive Avalanche Allowed up to Tjmax  
G
RDS(on) = 14mΩ  
Description  
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea. Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitive avalanche rating . These features com-  
binetomakethisdesignanextremelyefficientand  
reliable device for use in Automotive applications  
and a wide variety of other applications.  
S
D-Pak  
I-Pak  
IRLU3110ZPbF  
IRLR3110ZPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
63  
Units  
I
I
I
I
@ T = 25°C  
C
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
D
D
D
@ T = 100°C  
C
45  
A
@ T = 25°C  
C
42  
250  
140  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
0.95  
±16  
W/°C  
V
V
Gate-to-Source Voltage  
GS  
EAS (Thermally limited)  
110  
140  
mJ  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
mJ  
Repetitive Avalanche Energy  
T
J
-55 to + 175  
Operating Junction and  
T
°C  
Storage Temperature Range  
STG  
Reflow Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.05  
40  
Units  
Rθ  
JC  
Junction-to-Case  
Rθ  
JA  
Rθ  
JA  
°C/W  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
110  
HEXFET® isaregisteredtrademarkofInternationalRectifier.  
www.irf.com  
1
03/09/06  

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