Datasheet > IRLR3303TRR

IRLR3303TRR

更新时间： 2024-11-24 19:51:43

品牌	Logo	应用领域
英飞凌 - INFINEON		开关脉冲晶体管
页数	文件大小	规格书
11页	149K
描述
Power Field-Effect Transistor, 35A I(D), 30V, 0.031ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, D2PAK-3

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IRLR3303TRR 数据手册

PD- 91316F

IRLR/U3303

HEXFET^®Power MOSFET

l Logic-Level Gate Drive

l Ultra Low On-Resistance

l Surface Mount (IRLR3303)

l Straight Lead (IRLU3303)

l Advanced Process Technology

l Fast Switching

V_DSS= 30V

R_DS(on)= 0.031Ω

I_D= 35Aꢀ

l Fully Avalanche Rated

Description

Fifth Generation HEXFETs from International Rectifier utilize advanced

processing techniques to achieve the lowest possible on-resistance per

silicon area. This benefit, combined with the fast switching speed and

ruggedized device design that HEXFET Power MOSFETs are well known for,

provides the designer with an extremely efficient device for use in a wide

variety of applications.

D-Pak

T O -252AA

I-Pak

TO -251AA

The D-PAK is designed for surface mounting using vapor phase, infrared, or

wave soldering techniques. The straight lead version (IRFU series) is for

through-hole mounting applications. Power dissipation levels up to 1.5 watts

are possible in typical surface mount applications.

Absolute Maximum Ratings

Parameter

Max.

35 ꢀ

Units

I_D@ T_C= 25°C

I_D@ T_C= 100°C

I_DM

Continuous Drain Current, V_GS@ 10V

Pulsed Drain Current

140

P_D@T_C= 25°C

PowerDissipation

W/°C

LinearDeratingFactor

0.45

± 16

130

V_GS

E_AS

I_AR

Gate-to-SourceVoltage

Single Pulse Avalanche Energy

AvalancheCurrent

E_AR

dv/dt

T_J

RepetitiveAvalancheEnergy

Peak Diode Recovery dv/dt

OperatingJunctionand

6.8

V/ns

5.0

-55 to + 175

T_STG

StorageTemperatureRange

SolderingTemperature, for10seconds

°C

300 (1.6mm from case )

Thermal Resistance

Parameter

Junction-to-Case

Typ.

–––

Max.

2.2

Units

R_θJC

R_θJA

Case-to-Ambient(PCBmount)**

Junction-to-Ambient

–––

°C/W

–––

110

** When mounted on 1" square PCB (FR-4 or G-10 Material ) .

For recommended footprint and soldering techniques refer to application note #AN-994

www.irf.com

9/28/98

12 3 4 5 6 7...11

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