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IRLR3636 PDF预览

IRLR3636

更新时间: 2024-11-25 11:13:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 393K
描述
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. 

IRLR3636 数据手册

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PD - 96224  
IRLR3636PbF  
IRLU3636PbF  
HEXFET® Power MOSFET  
Applications  
l DC Motor Drive  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
D
S
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
60V  
5.4m  
6.8m  
99A  
G
Benefits  
50A  
l Optimized for Logic Level Drive  
l Very Low RDS(ON) at 4.5V VGS  
l Superior R*Q at 4.5V VGS  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
D
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
S
D
G
G
D-Pak  
I-Pak  
IRLU3636PbF  
IRLR3636PbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
99  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
70  
A
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
50  
396  
143  
0.95  
±16  
22  
PD @TC = 25°C  
W
Maximum Power Dissipation  
Linear Derating Factor  
W/°C  
V
VGS  
Gate-to-Source Voltage  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
Operating Junction and  
-55 to + 175  
TSTG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
170  
mJ  
A
Avalanche Current  
IAR  
See Fig.14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.05  
50  
Units  
RθJC  
Junction-to-Case  
RθJA  
RθJA  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
°C/W  
110  
www.irf.com  
1
02/06/09  

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