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IRLB8721PBF PDF预览

IRLB8721PBF

更新时间: 2024-11-21 11:10:23
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 268K
描述
HEXFET Power MOSFET

IRLB8721PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:1.08
雪崩能效等级(Eas):98 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):62 A最大漏极电流 (ID):62 A
最大漏源导通电阻:0.0087 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):65 W
最大脉冲漏极电流 (IDM):250 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRLB8721PBF 数据手册

 浏览型号IRLB8721PBF的Datasheet PDF文件第2页浏览型号IRLB8721PBF的Datasheet PDF文件第3页浏览型号IRLB8721PBF的Datasheet PDF文件第4页浏览型号IRLB8721PBF的Datasheet PDF文件第5页浏览型号IRLB8721PBF的Datasheet PDF文件第6页浏览型号IRLB8721PBF的Datasheet PDF文件第7页 
PD - 97390  
IRLB8721PbF  
HEXFET® Power MOSFET  
Applications  
l Optimized for UPS/Inverter Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power 30V  
l High Frequency Isolated DC-DC  
VDSS  
RDS(on) max  
Qg (typ.)  
7.6nC  
8.7m @VGS = 10V  
D
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
Benefits  
S
D
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
G
TO-220AB  
IRLB8721PbF  
l Lead-Free  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
30  
Drain-to-Source Voltage  
V
± 20  
Gate-to-Source Voltage  
V
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
62  
I
I
I
@ TC = 25°C  
D
D
44  
250  
A
@ TC = 100°C  
DM  
65  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
P
P
@TC = 25°C  
@TC = 100°C  
D
D
W
33  
0.43  
W/°C  
-55 to + 175  
Operating Junction and  
T
T
J
Storage Temperature Range  
STG  
°C  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
300 (1.6mm from case)  
10lb in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
0.5  
Max.  
2.3  
Units  
Junction-to-Case  
RθJC  
RθCS  
RθJA  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
62  
–––  
Notes  through are on page 9  
www.irf.com  
1
4/22/09  

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