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IRLB8748PBF PDF预览

IRLB8748PBF

更新时间: 2024-11-09 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
9页 265K
描述
HEXFET Power MOSFET

IRLB8748PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:1.13雪崩能效等级(Eas):114 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):92 A
最大漏极电流 (ID):78 A最大漏源导通电阻:0.0048 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):75 W最大脉冲漏极电流 (IDM):370 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRLB8748PBF 数据手册

 浏览型号IRLB8748PBF的Datasheet PDF文件第2页浏览型号IRLB8748PBF的Datasheet PDF文件第3页浏览型号IRLB8748PBF的Datasheet PDF文件第4页浏览型号IRLB8748PBF的Datasheet PDF文件第5页浏览型号IRLB8748PBF的Datasheet PDF文件第6页浏览型号IRLB8748PBF的Datasheet PDF文件第7页 
PD - 96231  
IRLB8748PbF  
HEXFET® Power MOSFET  
Applications  
l Optimized for UPS/Inverter Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial use  
VDSS RDS(on) max  
Qg  
15nC  
4.8m  
30V  
D
S
D
G
Benefits  
TO-220AB  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
IRLB8748PbF  
G
D
S
Gate  
Drain  
Source  
l Lead-Free  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
30  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
± 20  
V
GS  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
92  
I
I
I
I
@ TC = 25°C  
D
D
D
65  
@ TC = 100°C  
@ TC = 25°C  
A
78  
370  
DM  
75  
38  
Maximum Power Dissipation  
P
P
@TC = 25°C  
D
D
W
@TC = 100°C Maximum Power Dissipation  
Linear Derating Factor  
0.5  
W/°C  
-55 to + 175  
T
T
Operating Junction and  
J
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case)  
10 lbf  
in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
0.5  
Max.  
2.0  
Units  
RθJC  
Junction-to-Case  
RθCS  
RθJA  
–––  
62  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
Notes through ‡ are on page 9  
www.irf.com  
1
04/22/09  

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