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IRLBL1304 PDF预览

IRLBL1304

更新时间: 2024-11-25 04:23:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 125K
描述
HEXFET㈢ Power MOSFET

IRLBL1304 数据手册

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PD-91843A  
IRLBL1304  
HEXFET® Power MOSFET  
l >1mm lower profile than D2Pak  
l Same footprint as D2pak  
l Logic Level Gate  
D
VDSS = 40V  
l Surface mount  
R
DS(on) = 0.0045Ω  
l Ultra Low On-Resistance  
l Fully Avalanche Rated  
l 50% greater current in typ. application  
condition vs. D2Pak  
G
ID = 185Aꢀ  
S
Description  
The HEXFET® MOSFET is the most popular power MOSFET in the world.  
This particular HEXFET® MOSFET is in the SuperD2PakTM and hasthe same  
outline and pinout as the standard D2Pak but has increased current handling  
capability and >1mm lower profile. This makes it ideal to reduce component  
count in multiparallel D2Pak operation, reduce system power dissipation or  
upgrade existing design.  
This package has also been designed to meet automotive qualification  
standard Q101 and can be used with normal surface mouting equipment  
and has the same temperature profile and recommendations as the  
commonly used D2Pak.  
Super-D2PakTM  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
D @ TC = 100°C  
Continuous Drain Current, VGS @ 10V†  
Continuous Drain Current, VGS @ 10V†  
Pulsed Drain Current †  
185, pkg limited to 95A*  
I
130, pkg limited to 95A*  
A
IDM  
740  
300  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
2.0  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 16  
Single Pulse Avalanche Energy‚†  
Avalanche Current  
1160  
100  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
30  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
260 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
Max.  
0.50  
40  
Units  
W
RθJC  
RθJA  
–––  
* Current capability in normal application, see Fig.9.  
www.irf.com  
1
2/16/00  

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