IRLD024, SiHLD024
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
60
Available
• For Automatic Insertion
• End Stackable
R
DS(on) (Ω)
VGS = 5.0 V
0.10
RoHS*
Qg (Max.) (nC)
18
4.5
12
COMPLIANT
• Logic-Level Gate Drive
• RDS(on) Specified at VGS = 4 V and 5 V
• 175 °C Operating Temperature
• Fast Switching
Q
Q
gs (nC)
gd (nC)
Configuration
Single
D
• Lead (Pb)-free Available
HEXDIP
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertiable
case style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain servers as a
thermal link to the mounting surface for power dissipation
levels up to 1 W.
G
S
G
D
S
N-Channel MOSFET
ORDERING INFORMATION
Package
HEXDIP
IRLD024PbF
SiHLD024-E3
IRLD024
Lead (Pb)-free
SnPb
SiHLD024
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
60
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
10
TC = 25 °C
TC =100°C
2.5
Continuous Drain Current
VGS at 5.0 V
ID
1.8
20
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.0083
91
W/°C
mJ
Single Pulse Avalanche Energyb
Maximum Power Dissipation
EAS
PD
T
C = 25 °C
1.3
W
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
4.5
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 175
300d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 16 mH, RG = 25 Ω, IAS = 2.5 A (see fig. 12).
c. ISD ≤ 17 A, dI/dt ≤ 140 A/µs, VDD ≤ VDS, TJ ≤ 175 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91308
S-81378-Rev. A, 07-Jul-08
www.vishay.com
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