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IRLB8748 PDF预览

IRLB8748

更新时间: 2024-11-26 11:14:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 273K
描述
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. 

IRLB8748 数据手册

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PD - 96231  
IRLB8748PbF  
HEXFET® Power MOSFET  
Applications  
l Optimized for UPS/Inverter Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial use  
VDSS RDS(on) max  
Qg  
15nC  
4.8m  
30V  
D
S
D
G
Benefits  
TO-220AB  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
IRLB8748PbF  
G
D
S
Gate  
Drain  
Source  
l Lead-Free  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
30  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
± 20  
V
GS  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
92  
I
I
I
I
@ TC = 25°C  
D
D
D
65  
@ TC = 100°C  
@ TC = 25°C  
A
78  
370  
DM  
75  
38  
Maximum Power Dissipation  
P
P
@TC = 25°C  
D
D
W
@TC = 100°C Maximum Power Dissipation  
Linear Derating Factor  
0.5  
W/°C  
-55 to + 175  
T
T
Operating Junction and  
J
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case)  
10 lbf  
in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
0.5  
Max.  
2.0  
Units  
RθJC  
Junction-to-Case  
RθCS  
RθJA  
–––  
62  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
Notes through ‡ are on page 9  
www.irf.com  
1
04/22/09  

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