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IRHF7310 PDF预览

IRHF7310

更新时间: 2024-11-05 23:58:55
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IRHF7310 数据手册

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Provisional Data Sheet No. PD-9.1444  
REPETITIVE AVALANCHE AND dv/dt RATED  
HEXFET® TRANSISTOR  
IRHF7310SE  
N-CHANNEL  
SINGLE EVENT EFFECT (SEE) RAD HARD  
400 Volt, 4.5, (SEE) RAD HARD HEXFET  
Product Summary  
Part Number  
BVDSS  
RDS(on)  
ID  
International Rectifier’s (SEE)RAD HARD technology  
HEXFETs demonstrate virtual immunity to SEE fail-  
ure.Additionally, under identical pre- and post-radia-  
tion test conditions, International Rectifier’s RAD HARD  
HEXFETs retain identical electrical specifications up  
to 1 x 105 Rads (Si) total dose. No compensation in  
gate drive circuitry is required.These devices are also  
capable of surviving transient ionization pulses as high  
as 1 x 1012 Rads (Si)/Sec, and return to normal opera-  
tion within a few microseconds. Since the SEE pro-  
cess utilizes International Rectifier’s patented HEXFET  
technology, the user can expect the highest quality  
and reliability in the industry.  
IRHF7310SE  
400V  
4.5Ω  
1.15A  
Features:  
Radiation Hardened up to 1 x 105 Rads (Si)  
Single Event Burnout (SEB) Hardened  
Single Event Gate Rupture (SEGR) Hardened  
Gamma Dot (Flash X-Ray) Hardened  
Neutron Tolerant  
Identical Pre- and Post-Electrical Test Conditions  
Repetitive Avalanche Rating  
Dynamic dv/dt Rating  
Simple Drive Requirements  
Ease of Paralleling  
RAD HARD HEXFET transistors also feature all of the  
well-established advantages of MOSFETs, such as volt-  
age control, very fast switching, ease of paralleling and  
temperature stability of the electrical parameters.  
Hermetically Sealed  
They are well-suited for applications such as switch-  
ing power supplies, motor controls, inverters, chop-  
pers, audio amplifiers and high-energy pulse circuits  
in space and weapons environments.  
Absolute Maximum Ratings  
Parameter  
IRHF7310SE  
Units  
I
@ V  
@ V  
= 12V, T = 25°C Continuous Drain Current  
GS C  
1.15  
0.70  
4.6  
D
I
= 12V, T = 100°C Continuous Drain Current  
C
D
GS  
A
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy ➁  
Peak Diode Recovery dv/dt ➂  
Operating Junction  
DM  
@ T = 25°C  
P
D
15  
W
W/K ➄  
V
C
2.0  
V
±20  
GS  
E
AS  
dv/dt  
75  
mJ  
4.0  
V/ns  
T
J
-55 to 150  
T
Storage Temperature Range  
Lead Temperature  
STG  
(0.063 in. (1.6mm) from  
case for 10 sec.)  
0.98 (typical)  
300  
oC  
g
Weight  

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