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IRHF8230

更新时间： 2024-11-05 22:48:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
12页 304K
描述
REPETITIVE AVALANCHE AND dv/dt RATED HEXFET?? TRANSISTOR

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中文翻译

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IRHF8230 技术参数

是否Rohs认证： 不符合生命周期：Active
包装说明：CYLINDRICAL, O-MBCY-W3Reach Compliance Code：compliant
ECCN代码：EAR99风险等级：5.16
其他特性：RADIATION HARDENED雪崩能效等级（Eas）：240 mJ
配置：SINGLE WITH BUILT-IN DIODE最小漏源击穿电压：200 V
最大漏极电流 (Abs) (ID)：5.5 A最大漏极电流 (ID)：5.5 A
最大漏源导通电阻：0.36 ΩFET 技术：METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码：TO-39JESD-30 代码：O-MBCY-W3
JESD-609代码：e0元件数量：1
端子数量：3工作模式：ENHANCEMENT MODE
最高工作温度：150 °C封装主体材料：METAL
封装形状：ROUND封装形式：CYLINDRICAL
峰值回流温度（摄氏度）：NOT SPECIFIED极性/信道类型：N-CHANNEL
最大功率耗散 (Abs)：25 W最大脉冲漏极电流 (IDM)：22 A
认证状态：Not Qualified子类别：FET General Purpose Power
表面贴装：NO端子面层：Tin/Lead (Sn/Pb)
端子形式：WIRE端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED晶体管应用：SWITCHING
晶体管元件材料：SILICONBase Number Matches：1

IRHF8230 数据手册

 浏览型号IRHF8230的Datasheet PDF文件第2页浏览型号IRHF8230的Datasheet PDF文件第3页浏览型号IRHF8230的Datasheet PDF文件第4页浏览型号IRHF8230的Datasheet PDF文件第5页浏览型号IRHF8230的Datasheet PDF文件第6页浏览型号IRHF8230的Datasheet PDF文件第7页 
PD - 90672C  
IRHF7230  
IRHF8230  
JANSR2N7262  
REPETITIVE AVALANCHE AND dv/dt RATED  
HEXFET® TRANSISTOR  
JANSH2N7262  
[REF:MIL-PRF-19500/601]  
N CHANNEL  
MEGA RAD HARD  
Product Summary  
200Volt, 0.35Ω, MEGA RAD HARD HEXFET  
International Rectifier’s RAD HARD technology  
HEXFETs demonstrate excellent threshold voltage  
stability and breakdown voltage stability at total  
radiaition doses as high as 1x106 Rads(Si). Under  
identical pre- and post-irradiation test conditions, In-  
ternational Rectifier’s RAD HARD HEXFETs retain  
identical electrical specifications up to 1 x 105 Rads  
(Si) total dose. No compensation in gate drive circuitry  
is required. These devices are also capable of surviv-  
ing transient ionization pulses as high as 1 x 1012 Rads  
(Si)/Sec, and return to normal operation within a few  
microseconds. Since the RAD HARD process utilizes  
International Rectifier’s patented HEXFET technology,  
the user can expect the highest quality and reliability  
in the industry.  
Part Number  
IRHF7230  
IRHF8230  
BVDSS  
200V  
200V  
RDS(on)  
0.35Ω  
0.35Ω  
ID  
5.5A  
5.5A  
Features:  
n
n
n
n
n
n
n
n
n
n
n
n
n
Radiation Hardened up to 1 x 106 Rads (Si)  
Single Event Burnout (SEB) Hardened  
Single Event Gate Rupture (SEGR) Hardened  
Gamma Dot (Flash X-Ray) Hardened  
Neutron Tolerant  
Identical Pre- and Post-Electrical Test Conditions  
Repetitive Avalanche Rating  
Dynamic dv/dt Rating  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
RAD HARD HEXFET transistors also feature all of  
the well-established advantages of MOSFETs, such  
as voltage control, very fast switching, ease of paral-  
leling and temperature stability of the electrical pa-  
rameters. They are well-suited for applications such  
as switching power supplies, motor controls, invert-  
ers, choppers, audio amplifiers and high-energy  
pulse circuits in space and weapons environments.  
Surface Mount  
Lightweight  
Pre-Irradiation  
Absolute Maximum Ratings   
Parameter  
IRHF7230, IRHF8230  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
5.5  
D
GS  
C
A
I
D
= 12V, T = 100°C Continuous Drain Current  
3.5  
GS  
C
I
Pulsed Drain Current ‚  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
22  
DM  
@ T = 25°C  
P
D
25  
W
W/°C  
V
C
0.2  
V
±20  
GS  
E
Single Pulse Avalanche Energy ƒ  
Peak Diode Recovery dv/dt „  
Operating Junction  
240  
mJ  
AS  
dv/dt  
5.0  
V/ns  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063 in. (1.6mm) from case for 10s)  
0.98 (typical)  
www.irf.com  
1
10/13/98  
1234567...12

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