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IRHG57110 PDF预览

IRHG57110

更新时间: 2024-11-04 21:54:03
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 112K
描述
RADIATION HARDENED POWER MOSFET THRU-HOLE (MO-036)

IRHG57110 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:IN-LINE, R-CDIP-T14Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.32
Is Samacsys:N雪崩能效等级(Eas):130 mJ
配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):1.8 A最大漏极电流 (ID):1.8 A
最大漏源导通电阻:0.29 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MO-036ABJESD-30 代码:R-CDIP-T14
JESD-609代码:e0元件数量:4
端子数量:14工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.4 W
最大脉冲漏极电流 (IDM):6.4 A认证状态:Not Qualified
参考标准:RH - 100K Rad(Si)子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):45 ns
最大开启时间(吨):37 nsBase Number Matches:1

IRHG57110 数据手册

 浏览型号IRHG57110的Datasheet PDF文件第2页浏览型号IRHG57110的Datasheet PDF文件第3页浏览型号IRHG57110的Datasheet PDF文件第4页浏览型号IRHG57110的Datasheet PDF文件第5页浏览型号IRHG57110的Datasheet PDF文件第6页浏览型号IRHG57110的Datasheet PDF文件第7页 
PD - 94432A  
IRHG57110  
100V, Quad N-CHANNEL  
RAD-HardHEXFET®  
RADIATION HARDENED  
POWER MOSFET  
TECHNOLOGY  
THRU-HOLE (MO-036)  
R
5
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHG57110 100K Rads (Si)  
IRHG53110 300K Rads (Si)  
IRHG54110 600K Rads (Si)  
0.29Ω  
0.29Ω  
0.29Ω  
1.6A  
1.6A  
1.6A  
1.6A  
IRHG58110 1000K Rads (Si) 0.31Ω  
MO-036AB  
Features:  
International Rectifier’s RAD-HardTM HEXFET® MOSFET  
Technology provides high performance power MOSFETs  
for space applications. This technology has over a decade  
of proven performance and reliability in satellite applica-  
tions. These devices have been characterized for both  
Total Dose and Single Event Effects (SEE). The combina-  
tion of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC con-  
verters and motor control. These devices retain all of the  
well established advantages of MOSFETs such as voltage  
control, fast switching, ease of paralleling and tempera-  
ture stability of electrical parameters.  
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings (Per Die)  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
1.6  
D
GS  
C
A
I
D
= 12V, T = 100°C Continuous Drain Current  
1.0  
6.4  
GS  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
1.4  
W
W/°C  
V
D
C
Linear Derating Factor  
0.011  
±20  
V
Gate-to-Source Voltage  
GS  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
130  
mJ  
A
AS  
I
1.6  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
0.14  
mJ  
V/ns  
AR  
dv/dt  
6.5  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.63 in./1.6 mm from case for 10s)  
1.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
08/01/02  

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