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IRG7PH35UD1-EP PDF预览

IRG7PH35UD1-EP

更新时间: 2024-11-05 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管开关晶体管
页数 文件大小 规格书
9页 402K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRA-LOW VF DIODE FOR INDUCTION HEATING AND SOFT SWITCHING APPLICATIONS

IRG7PH35UD1-EP 数据手册

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PD - 97455  
IRG7PH35UD1PbF  
IRG7PH35UD1-EP  
INSULATEDGATEBIPOLARTRANSISTORWITHULTRA-LOWVFDIODE  
FORINDUCTIONHEATINGANDSOFTSWITCHINGAPPLICATIONS  
Features  
C
• Low VCE (ON) trench IGBT Technology  
• Low Switching Losses  
• SquareRBSOA  
• Ultra-LowVF Diode  
• 1300Vpk Repetitive Transient Capacity  
VCES = 1200V  
I NOMINAL = 20A  
G
• 100% of the Parts Tested for ILM  

TJ(max) = 150°C  
VCE(on) typ. = 1.9V  
• Positive VCE (ON) Temperature Co-Efficient  
• TightParameterDistribution  
• LeadFreePackage  
E
n-channel  
Benefits  
C
C
• Device optimized for induction heating and soft switching  
applications  
• High Efficiency due to Low VCE(on), low switching losses  
andUltra-lowVF  
• Ruggedtransientperformanceforincreasedreliability  
• Excellent current sharing in parallel operation  
• Low EMI  
E
E
C
C
G
G
TO-247AC  
TO-247AD  
IRG7PH35UD1PbF  
IRG7PH35UD1-EP  
G
C
E
Gate  
Collector  
Emitter  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Nominal Current  
1200  
V
VCES  
50  
IC @ TC = 25°C  
25  
IC @ TC = 100°C  
20  
INOMINAL  
ICM  
Pulse Collector Current, VGE=15V  
Clamped Inductive Load Current, VGE=20V  
60  
A
ILM  
80  
Diode Continous Forward Current  
Diode Continous Forward Current  
Diode Maximum Forward Current  
50  
25  
IF @ TC = 25°C  
IF @ TC = 100°C  
80  
IFM  
Continuous Gate-to-Emitter Voltage  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
±30  
V
VGE  
179  
W
PD @ TC = 25°C  
71  
PD @ TC = 100°C  
-55 to +150  
TJ  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw  
°C  
TSTG  
300 (0.063 in. (1.6mm) from case)  
10 lbf·in (1.1 N·m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
–––  
Typ.  
–––  
–––  
0.24  
40  
Max.  
0.70  
1.35  
–––  
Units  
Rθ (IGBT)  
Thermal Resistance Junction-to-Case-(each IGBT)  
Thermal Resistance Junction-to-Case-(each Diode)  
JC  
Rθ (Diode)  
JC  
°C/W  
Rθ  
Thermal Resistance, Case-to-Sink (flat, greased surface)  
Thermal Resistance, Junction-to-Ambient (typical socket mount)  
CS  
Rθ  
JA  
–––  
1
www.irf.com  
02/09/2010  

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