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IRG4BC15UDPBF PDF预览

IRG4BC15UDPBF

更新时间: 2024-11-06 03:04:43
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管双极型晶体管功率控制双极性晶体管局域网超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
10页 264K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

IRG4BC15UDPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.02
其他特性:ULTRA FAST SOFT RECOVERY外壳连接:COLLECTOR
最大集电极电流 (IC):14 A集电极-发射极最大电压:600 V
配置:SINGLE WITH BUILT-IN DIODE最大降落时间(tf):120 ns
门极发射器阈值电压最大值:6 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):49 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):400 ns
标称接通时间 (ton):37 nsBase Number Matches:1

IRG4BC15UDPBF 数据手册

 浏览型号IRG4BC15UDPBF的Datasheet PDF文件第2页浏览型号IRG4BC15UDPBF的Datasheet PDF文件第3页浏览型号IRG4BC15UDPBF的Datasheet PDF文件第4页浏览型号IRG4BC15UDPBF的Datasheet PDF文件第5页浏览型号IRG4BC15UDPBF的Datasheet PDF文件第6页浏览型号IRG4BC15UDPBF的Datasheet PDF文件第7页 
PD - 95613  
IRG4BC15UDPbF  
UltraFast CoPack IGBT  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
C
Features  
VCES = 600V  
• UltraFast: Optimized for high frequencies from10 to  
30 kHz in hard switching  
• IGBT Co-packaged with ultra-soft-recovery  
antiparallel diode  
• Industry standard TO-220AB package  
• Lead-Free  
VCE(on) typ. = 2.02V  
@VGE = 15V, IC = 7.8A  
G
E
n-channel  
Benefits  
• Best Value for Appliance and Industrial Applications  
• High noise immune "Positive Only" gate drive-  
Negative bias gate drive not necessary  
• For Low EMI designs- requires little or no snubbing  
• Single Package switch for bridge circuit applications  
• Compatible with high voltage Gate Driver IC's  
• Allows simpler gate drive  
TO-220AB  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
600  
V
IC @ TC = 25°C  
14  
IC @ TC = 100°C  
7.8  
ICM  
42  
A
ILM  
42  
IF @ TC = 100°C  
4.0  
IFM  
16  
± 20  
VGE  
V
PD @ TC = 25°C  
Maximum Power Dissipation  
49  
W
PD @ TC = 100°C Maximum Power Dissipation  
19  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf•in (1.1 N•m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
–––  
–––  
Typ.  
–––  
–––  
Max.  
2.7  
7.0  
Units  
RθJC  
RθJC  
RθCS  
RθJA  
Wt  
Junction-to-Case - IGBT  
Junction-to-Case - Diode  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Weight  
°C/W  
0.50  
–––  
80  
–––  
2 (0.07)  
–––  
g (oz)  
www.irf.com  
1
8/2/04  

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