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IRG4BC20FDPBF PDF预览

IRG4BC20FDPBF

更新时间: 2024-11-06 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
11页 314K
描述
INSULATED GATEBIPOLAR TRANSISTOR WITH ULTRAFAST SOFR RECOVERY DIODE

IRG4BC20FDPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:6.75
外壳连接:COLLECTOR最大集电极电流 (IC):16 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:6 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):64 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):610 ns
标称接通时间 (ton):63 nsBase Number Matches:1

IRG4BC20FDPBF 数据手册

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PD - 94906  
IRG4BC20FDPbF  
INSULATEDGATEBIPOLARTRANSISTORWITHULTRAFAST  
Fast CoPack IGBT  
SOFTRECOVERYDIODE  
Features  
C
• Fast: optimized for medium operating  
frequencies ( 1-5 kHz in hard switching, >20  
kHz in resonant mode)#  
VCES = 600V  
• Generation 4 IGBT design provides tighter  
parameter distribution and higher efficiency than  
Generation 3  
VCE(on) typꢀ = 1ꢀ66V  
@VGE = 15V, IC = 9ꢀ0A  
G
• IGBT co-packaged with HEXFREDTM ultrafast,  
ultra-soft-recovery anti-parallel diodes for use in  
bridge configurations  
E
n-channel  
• Industry standard TO-220AB package  
• Lead-Free  
Benefits  
• Generation -4 IGBTs offer highest efficiencies  
available  
• IGBTs optimized for specific application conditions  
• HEXFRED diodes optimized for performance with  
IGBTs# Minimized recovery characteristics require  
less/no snubbing  
• Designed to be a "drop-in" replacement for equivalent  
industry-standard Generation 3 IR IGBTs  
Absolute Maximum Ratings  
TO-220AB  
Parameter  
Maxꢀ  
600  
16  
Units  
V
VCES  
C @ TC = 25°C  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
I
IC @ TC = 100°C  
9ꢀ0  
64  
ICM  
A
ILM  
64  
IF @ TC = 100°C  
7ꢀ0  
32  
IFM  
VGE  
± 20  
60  
V
PD @ TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating  
W
PD @ TC = 100°C  
24  
TJ  
Junction  
and-55  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 secꢀ  
Mounting Torque, 6-32 or M3 Screwꢀ  
°C  
300 (0ꢀ063 inꢀ (1ꢀ6mm) from case)  
10 lbf•in (1ꢀ1 N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case - IGBT  
Minꢀ  
–––  
–––  
–––  
–––  
–––  
Typꢀ  
–––  
Maxꢀ  
2ꢀ1  
Units  
RθJC  
RθJC  
RθCS  
RθJA  
Wt  
Junction-to-Case - Diode  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Weight  
–––  
3ꢀ5  
°C/W  
0ꢀ50  
–––  
80  
–––  
2 (0ꢀ07)  
–––  
g (oz)  
www.irf.com  
1
12/23/03  

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