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IRG4BC20FD PDF预览

IRG4BC20FD

更新时间: 2024-11-05 22:33:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管晶体管超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
10页 222K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, Vce(on)typ.=1.66V, @Vge=15V, Ic=9.0A)

IRG4BC20FD 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TO-220AB, 3 PINReach Compliance Code:compliant
风险等级:5其他特性:ULTRA FAST SOFT RECOVERY
外壳连接:COLLECTOR最大集电极电流 (IC):16 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):610 ns标称接通时间 (ton):63 ns
Base Number Matches:1

IRG4BC20FD 数据手册

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PD 91601A  
IRG4BC20FD  
Fast CoPack IGBT  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
Features  
C
Fast: optimized for medium operating  
frequencies ( 1-5 kHz in hard switching, >20  
kHz in resonant mode).  
VCES = 600V  
VCE(on) typ. = 1.66V  
@VGE = 15V, IC = 9.0A  
Generation 4 IGBT design provides tighter  
G
parameter distribution and higher efficiency than  
Generation 3  
E
IGBT co-packaged with HEXFREDTM ultrafast,  
n-channel  
ultra-soft-recovery anti-parallel diodes for use in  
bridge configurations  
Industry standard TO-220AB package  
Benefits  
Generation -4 IGBTs offer highest efficiencies  
available  
IGBTs optimized for specific application conditions  
HEXFRED diodes optimized for performance with  
IGBTs. Minimized recovery characteristics require  
less/no snubbing  
Designed to be a "drop-in" replacement for equivalent  
industry-standard Generation 3 IR IGBTs  
Absolute Maximum Ratings  
TO-220AB  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
600  
V
IC @ TC = 25°C  
16  
IC @ TC = 100°C  
9.0  
ICM  
64  
A
ILM  
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
64  
IF @ TC = 100°C  
7.0  
IFM  
32  
VGE  
20  
60  
V
PD @ TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
W
PD @ TC = 100°C  
24  
TJ  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf•in (1.1 N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case - IGBT  
Min.  
–––  
–––  
–––  
–––  
–––  
Typ.  
–––  
Max.  
2.1  
Units  
RθJC  
RθJC  
RθCS  
RθJA  
Wt  
Junction-to-Case - Diode  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Weight  
–––  
3.5  
°C/W  
0.50  
–––  
80  
–––  
2 (0.07)  
–––  
g (oz)  
www.irf.com  
1
7/11/2000  

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