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IRG4BC20FD-S PDF预览

IRG4BC20FD-S

更新时间: 2024-11-05 22:07:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管晶体管超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
10页 223K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, Vce(on)typ.=1.66V, @Vge=15V, Ic=9.0A)

IRG4BC20FD-S 数据手册

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PD -91783A  
IRG4BC20FD-S  
Fast CoPack IGBT  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
Features  
C
Fast: Optimized for medium operating  
frequencies ( 1-5 kHz in hard switching, >20  
kHz in resonant mode).  
VCES = 600V  
VCE(on) typ. = 1.66V  
@VGE = 15V, IC = 9.0A  
Generation 4 IGBT design provides tighter  
G
parameter distribution and higher efficiency than  
Generation 3  
IGBT co-packaged with HEXFREDTM ultrafast,  
ultra-soft-recovery anti-parallel diodes for use  
in bridge configurations  
Industry standard D2Pak package  
E
n-channel  
Benefits  
Generation 4 IGBTs offer highest efficiencies  
available  
IGBTs optimized for specific application conditions  
HEXFRED diodes optimized for performance with  
IGBTs . Minimized recovery characteristics require  
less/no snubbing  
Designed to be a "drop-in" replacement for equivalent  
industry-standard Generation 3 IR IGBTs  
Absolute Maximum Ratings  
D 2 Pak  
Parameter  
Max.  
Units  
VCES  
C @ TC = 25°C  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
600  
V
I
16  
IC @ TC = 100°C  
9.0  
ICM  
64  
A
ILM  
64  
IF @ TC = 100°C  
8.0  
IFM  
60  
± 20  
VGE  
V
P
D @ TC = 25°C  
Maximum Power Dissipation  
60  
W
PD @ TC = 100°C Maximum Power Dissipation  
24  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
°C  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
2.1  
Units  
°C/W  
RθJC  
RθJC  
RθJA  
Wt  
Junction-to-Case - IGBT  
Junction-to-Case - Diode  
Junction-to-Ambient ( PCB Mounted,steady-state)*  
Weight  
–––  
3.5  
–––  
80  
1.44  
–––  
g (oz)  
* When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques  
refer to application note #AN-994.  
www.irf.com  
1
4/24/2000  

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