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IRG4BC20MDS PDF预览

IRG4BC20MDS

更新时间: 2024-11-08 22:33:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管晶体管超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
11页 203K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, Vce(on)typ.=1.85V, @Vge=15V, Ic=11A)

IRG4BC20MDS 数据手册

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PD -94116  
IRG4BC20MD-S  
Short Circuit Rated  
Fast IGBT  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
C
Features  
Rugged: 10µsec short circuit capable at VGS=15V  
VCES = 600V  
Low VCE(on) for 4 to 10kHz applications  
IGBT Co-packaged with ultra-soft-recovery  
antiparallel diode  
VCE(on) typ. = 1.85V  
@VGE = 15V, IC = 11A  
Industry standard D2Pak package  
G
Benefits  
Offers highest efficiency and short circuit  
E
n-channel  
capability for intermediate applications  
Provides best efficiency for the mid range frequency  
(4 to 10kHz)  
Optimized for Appliance Motor Drives, Industrial (Short  
Circuit Proof) Drives and Intermediate Frequency  
Range Drives  
High noise immune "Positive Only" gate drive-  
Negative bias gate drive not necessary  
For Low EMI designs- requires little or no snubbing  
Single Package switch for bridge circuit applications  
Compatible with high voltage Gate Driver IC's  
Allows simpler gate drive  
D2Pak  
Absolute Maximum Ratings  
Parameter  
Max.  
600  
18  
Units  
V
VCES  
C @ TC = 25°C  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Short Circuit Withstand Time  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
I
IC @ TC = 100°C  
11  
ICM  
36  
A
ILM  
36  
IF @ TC = 100°C  
7.0  
10  
tsc  
µs  
A
IFM  
36  
VGE  
± 20  
60  
V
PD @ TC = 25°C  
Maximum Power Dissipation  
W
PD @ TC = 100°C Maximum Power Dissipation  
24  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbfin (1.1 Nm)  
Thermal Resistance  
Parameter  
Min.  
------  
------  
------  
-----  
Typ.  
------  
------  
0.50  
Max.  
2.1  
Units  
RθJC  
RθJC  
RθCS  
RθJA  
Wt  
Junction-to-Case - IGBT  
Junction-to-Case - Diode  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Weight  
2.5  
°C/W  
------  
80  
-----  
------  
2 (0.07)  
------  
g (oz)  
www.irf.com  
1
3/6/01  

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