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IRG4BC20SD PDF预览

IRG4BC20SD

更新时间: 2024-11-08 22:33:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管晶体管功率控制双极性晶体管局域网超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
10页 289K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, Vce(on)typ.=1.4V, @Vge=15V, Ic=10A)

IRG4BC20SD 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5Is Samacsys:N
其他特性:ULTRA FAST SOFT RECOVERY外壳连接:COLLECTOR
最大集电极电流 (IC):19 A集电极-发射极最大电压:600 V
配置:SINGLE WITH BUILT-IN DIODEJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):1780 ns
标称接通时间 (ton):99 nsBase Number Matches:1

IRG4BC20SD 数据手册

 浏览型号IRG4BC20SD的Datasheet PDF文件第2页浏览型号IRG4BC20SD的Datasheet PDF文件第3页浏览型号IRG4BC20SD的Datasheet PDF文件第4页浏览型号IRG4BC20SD的Datasheet PDF文件第5页浏览型号IRG4BC20SD的Datasheet PDF文件第6页浏览型号IRG4BC20SD的Datasheet PDF文件第7页 
PD- 91793  
IRG4BC20SD  
Standard Speed IGBT  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
Features  
C
• Extremely low voltage drop 1.4Vtyp. @ 10A  
• S-Series: Minimizes power dissipation at up to 3  
KHz PWM frequency in inverter drives, up to 4  
KHz in brushless DC drives.  
VCES = 600V  
VCE(on) typ. = 1.4V  
G
• Very Tight Vce(on) distribution  
• IGBT co-packaged with HEXFREDTM ultrafast,  
ultra-soft-recovery anti-parallel diodes for use  
in bridge configurations  
@VGE = 15V, IC = 10A  
E
n-channel  
• Industry standard TO-220AB package  
Benefits  
• Generation 4 IGBT's offer highest efficiencies  
available  
• IGBT's optimized for specific application conditions  
• HEXFRED diodes optimized for performance with  
IGBT's . Minimized recovery characteristics require  
less/no snubbing  
• Lower losses than MOSFET's conduction and  
Diode losses  
TO-220AB  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
C @ TC = 25°C  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
600  
V
I
19  
IC @ TC = 100°C  
10  
ICM  
38  
A
ILM  
38  
IF @ TC = 100°C  
7.0  
IFM  
38  
± 20  
VGE  
V
P
D @ TC = 25°C  
Maximum Power Dissipation  
60  
W
PD @ TC = 100°C Maximum Power Dissipation  
24  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf•in (1.1 N•m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
–––  
–––  
Typ.  
–––  
Max.  
2.1  
Units  
RθJC  
Junction-to-Case - IGBT  
Junction-to-Case - Diode  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Weight  
RθJC  
–––  
3.5  
°C/W  
RθCS  
0.50  
–––  
80  
RθJA  
–––  
Wt  
2 (0.07)  
–––  
g (oz)  
www.irf.com  
1
9/23/98  

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