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IRG4BC20FD-STRRPBF PDF预览

IRG4BC20FD-STRRPBF

更新时间: 2024-11-07 05:27:23
品牌 Logo 应用领域
英飞凌 - INFINEON 功率控制晶体管
页数 文件大小 规格书
12页 293K
描述
Insulated Gate Bipolar Transistor, 16A I(C), 600V V(BR)CES, N-Channel, LEAD FREE, PLASTIC, D2PAK-3

IRG4BC20FD-STRRPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
风险等级:5.55外壳连接:COLLECTOR
最大集电极电流 (IC):16 A集电极-发射极最大电压:600 V
配置:SINGLE WITH BUILT-IN DIODEJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子面层:MATTE TIN OVER NICKEL
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):610 ns
标称接通时间 (ton):63 nsBase Number Matches:1

IRG4BC20FD-STRRPBF 数据手册

 浏览型号IRG4BC20FD-STRRPBF的Datasheet PDF文件第2页浏览型号IRG4BC20FD-STRRPBF的Datasheet PDF文件第3页浏览型号IRG4BC20FD-STRRPBF的Datasheet PDF文件第4页浏览型号IRG4BC20FD-STRRPBF的Datasheet PDF文件第5页浏览型号IRG4BC20FD-STRRPBF的Datasheet PDF文件第6页浏览型号IRG4BC20FD-STRRPBF的Datasheet PDF文件第7页 
PD -95965  
IRG4BC20FD-SPbF  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
Features  
Fast CoPack IGBT  
• Fast: Optimized for medium operating  
frequencies ( 1-5 kHz in hard switching, >20  
kHz in resonant mode).  
C
VCES = 600V  
• Generation 4 IGBT design provides tighter  
parameter distribution and higher efficiency than  
Generation 3  
VCE(on) typ. = 1.66V  
@VGE = 15V, IC = 9.0A  
G
• IGBT co-packaged with HEXFREDTM ultrafast,  
ultra-soft-recovery anti-parallel diodes for use  
in bridge configurations  
E
n-channel  
• Industry standard D2Pak package  
Lead-Free  
Benefits  
• Generation 4 IGBTs offer highest efficiencies  
available  
• IGBTs optimized for specific application conditions  
• HEXFRED diodes optimized for performance with  
IGBTs . Minimized recovery characteristics require  
less/no snubbing  
• Designed to be a "drop-in" replacement for equivalent  
industry-standard Generation 3 IR IGBTs  
D2Pak  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
C @ TC = 25°C  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
600  
V
I
16  
IC @ TC = 100°C  
9.0  
ICM  
64  
A
ILM  
64  
IF @ TC = 100°C  
8.0  
IFM  
60  
± 20  
VGE  
V
P
D @ TC = 25°C  
Maximum Power Dissipation  
60  
W
PD @ TC = 100°C Maximum Power Dissipation  
24  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
°C  
Thermal Resistance  
Parameter  
Junction-to-Case - IGBT  
Junction-to-Case - Diode  
Typ.  
–––  
Max.  
2.1  
Units  
°C/W  
RθJC  
RθJC  
RθJA  
Wt  
–––  
3.5  
Junction-to-Ambient ( PCB Mounted,steady-state)*  
–––  
80  
Weight  
1.44  
–––  
g (oz)  
* When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques  
refer to application note #AN-994.  
www.irf.com  
1
11/19/04  

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