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IRFZ34L PDF预览

IRFZ34L

更新时间: 2024-11-02 05:39:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管开关脉冲
页数 文件大小 规格书
8页 1009K
描述
Power MOSFET

IRFZ34L 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-262AA包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.04雪崩能效等级(Eas):200 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):30 A
最大漏极电流 (ID):30 A最大漏源导通电阻:0.05 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-262AA
JESD-30 代码:R-PSIP-T3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):225
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):88 W
最大脉冲漏极电流 (IDM):120 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFZ34L 数据手册

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IRFZ34S, IRFZ34L, SiHFZ34S, SiHFZ34L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Advanced Process Technology  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
• Surface Mount  
RDS(on) (Ω)  
VGS = 10 V  
0.050  
RoHS*  
• Low-Profile Through-Hole (IRFZ34L/SiHFZ34L)  
• 175 °C Operating Temperature  
• Fast Switching  
COMPLIANT  
Qg (Max.) (nC)  
46  
11  
Q
Q
gs (nC)  
gd (nC)  
22  
• Lead (Pb)-free Available  
Configuration  
Single  
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
G
G
D
S
The D2PAKis a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to 2  
W in a typical surface mount application.  
S
N-Channel MOSFET  
The through-hole version (IRFZ34L/SiHFZ34L) is available  
for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRFZ34SPbF  
SiHFZ34S-E3  
IRFZ34S  
D2PAK (TO-263)  
D2PAK (TO-263)  
IRFZ34STRLPbFa  
SiHFZ34STLPbFa  
IRFZ34STRLa  
I2PAK (TO-263)  
IRFZ34LPbF  
SiHFZ34L-E3  
IRFZ34L  
IRFZ34STRRPbFa  
SiHFZ34STRPbFa  
IRFZ34STRRa  
Lead (Pb)-free  
SnPb  
SiHFZ34S  
SiHFZ34STRa  
SiHFZ34STLa  
SiHFZ34L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
60  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
T
C = 25 °C  
30  
21  
120  
Continuous Drain Current  
V
GS at 10 V  
ID  
A
TC =100°C  
Pulsed Drain Currenta, e  
IDM  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
0.59  
200  
88  
3.7  
W/°C  
mJ  
EAS  
PD  
T
C = 25 °C  
Maximum Power Dissipation  
W
V/ns  
°C  
TA = 25 °C  
Peak Diode Recovery dV/dtc, e  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
dV/dt  
TJ, Tstg  
4.5  
- 55 to + 175  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, Starting TJ = 25 °C, L = 260 µH, RG = 25 Ω, IAS = 30 A (see fig. 12).  
c. ISD 30 A, dI/dt 200 A/µs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. Uses IRFZ34/SiHFZ34 data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 90368  
S-Pending-Rev. A, 22-Jul-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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