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IRFZ34VSTRLPBF PDF预览

IRFZ34VSTRLPBF

更新时间: 2024-11-21 13:08:51
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 197K
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IRFZ34VSTRLPBF 数据手册

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PD - _____  
PRELIMINARY  
IRFZ34N  
HEXFET® Power MOSFET  
Advanced Process Technology  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
VDSS = 55V  
RDS(on) = 0.040Ω  
ID = 26A  
Fully Avalanche Rated  
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced processing  
techniques to achieve the lowest possible on-resistance per silicon area. This  
benefit, combined with the fast switching speed and ruggedized device design that  
HEXFET Power MOSFETs are well known for, provides the designer with an  
extremely efficient device for use in a wide variety of applications.  
The TO-220 package is universally preferred for all commercial-industrial  
applications at power dissipation levels to approximately 50 watts. The low  
thermal resistance and low package cost of the TO-220 contribute to its wide  
acceptance throughout the industry.  
Absolute Maximum Ratings  
Parameter  
Continuous Drain Current, V GS @ 10V  
Continuous Drain Current, V GS @ 10V  
Pulsed Drain Current  
Max.  
26  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
18  
A
100  
56  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
0.37  
±20  
110  
16  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
5.6  
4.6  
mJ  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Min.  
––––  
––––  
––––  
Typ.  
––––  
0.50  
Max.  
2.7  
Units  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
––––  
62  
°C/W  
––––  
8/29/95  

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