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IRFZ34VSPBF PDF预览

IRFZ34VSPBF

更新时间: 2024-11-01 22:24:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 215K
描述
HEXFET Power MOSFET

IRFZ34VSPBF 数据手册

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PD - 95560  
IRFZ34VSPbF  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
IRFZ34VLPbF  
HEXFET® Power MOSFET  
D
VDSS = 60V  
l Fully Avalanche Rated  
l Optimized for SMPS Applications  
RDS(on) = 28mΩ  
G
l Lead-Free  
ID = 30A  
Description  
Advanced HEXFET® Power MOSFETs from International  
Rectifier utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized device  
design that HEXFET power MOSFETs are well known for,  
provides the designer with an extremely efficient and reliable  
device for use in a wide variety of applications.  
S
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the highest  
power capability and the lowest possible on-resistance in any  
existing surface mount package. The D2Pak is suitable for  
highcurrentapplicationsbecauseofitslowinternalconnection  
resistance and can dissipate up to 2.0W in a typical surface  
mount application.  
D2Pak  
IRFZ34VS  
TO-262  
IRFZ34VL  
The through-hole version (IRFZ34VL) is available for low-  
profile application.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10Vꢀ  
Pulsed Drain Current ꢀ  
30  
21  
120  
A
PD @TC = 25°C  
Power Dissipation  
70  
W
W/°C  
V
Linear Derating Factor  
0.46  
VGS  
IAR  
Gate-to-Source Voltage  
± 20  
Avalanche Current  
30  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒꢀ  
Operating Junction and  
7.0  
mJ  
V/ns  
4.5  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
2.15  
Units  
RθJC  
RθJA  
Junction-to-Ambient (PCB Mounted)**  
–––  
40  
°C/W  
www.irf.com  
1
07/15/04  

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