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IRFZ34S_11 PDF预览

IRFZ34S_11

更新时间: 2024-11-21 11:09:55
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威世 - VISHAY /
页数 文件大小 规格书
9页 355K
描述
Power MOSFET

IRFZ34S_11 数据手册

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IRFZ34S, IRFZ34L, SiHFZ34S, SiHFZ34L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
• Advanced Process Technology  
• Surface Mount  
60  
RDS(on) ()  
VGS = 10 V  
0.050  
Qg (Max.) (nC)  
46  
11  
• Low-Profile Through-Hole (IRFZ34L, SiHFZ34L)  
• 175 °C Operating Temperature  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
22  
• Compliant to RoHS Directive 2002/95/EC  
Configuration  
Single  
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
D
advanced processing techniques to achieve extremely low  
D2PAK (TO-263)  
I2PAK (TO-262)  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
G
G
D
S
D
The D2PAKis a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
S
G
S
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of  
N-Channel MOSFET  
its low internal connection resistance and can dissipate up  
to 2 W in a typical surface mount application.  
The through-hole version (IRFZ34L, SiHFZ34L) is available  
for low-profile applications.  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
-
IRFZ34SPbF  
SiHFZ34S-E3  
D2PAK (TO-263)  
-
IRFZ34STRRPbFa  
SiHFZ34STRPbFa  
D2PAK (TO-263)  
SiHFZ34STRL-GE3  
IRFZ34STRLPbFa  
SiHFZ34STLPbFa  
I2PAK (TO-262)  
-
IRFZ34LPbF  
SiHFZ34L-E3  
Lead (Pb)-free  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
60  
20  
V
T
C = 25 °C  
30  
21  
120  
Continuous Drain Current  
VGS at 10 V  
ID  
A
TC = 100 °C  
Pulsed Drain Currenta, e  
IDM  
Linear Derating Factor  
0.59  
200  
88  
3.7  
W/°C  
mJ  
Single Pulse Avalanche Energyb, e  
EAS  
PD  
T
C = 25 °C  
Maximum Power Dissipation  
W
V/ns  
°C  
TA = 25 °C  
Peak Diode Recovery dV/dtc, e  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
dV/dt  
TJ, Tstg  
4.5  
- 55 to + 175  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, Starting TJ = 25 °C, L = 260 μH, Rg = 25 , IAS = 30 A (see fig. 12).  
c. ISD 30 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. Uses IRFZ34, SiHFZ34 data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 90368  
S11-1045-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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