IRFZ34S, IRFZ34L, SiHFZ34S, SiHFZ34L
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
• Advanced Process Technology
• Surface Mount
60
RDS(on) ()
VGS = 10 V
0.050
Qg (Max.) (nC)
46
11
• Low-Profile Through-Hole (IRFZ34L, SiHFZ34L)
• 175 °C Operating Temperature
• Fast Switching
Q
Q
gs (nC)
gd (nC)
22
• Compliant to RoHS Directive 2002/95/EC
Configuration
Single
DESCRIPTION
Third generation Power MOSFETs from Vishay utilize
D
advanced processing techniques to achieve extremely low
D2PAK (TO-263)
I2PAK (TO-262)
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
G
G
D
S
D
The D2PAKis a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
S
G
S
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
N-Channel MOSFET
its low internal connection resistance and can dissipate up
to 2 W in a typical surface mount application.
The through-hole version (IRFZ34L, SiHFZ34L) is available
for low-profile applications.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
D2PAK (TO-263)
-
IRFZ34SPbF
SiHFZ34S-E3
D2PAK (TO-263)
-
IRFZ34STRRPbFa
SiHFZ34STRPbFa
D2PAK (TO-263)
SiHFZ34STRL-GE3
IRFZ34STRLPbFa
SiHFZ34STLPbFa
I2PAK (TO-262)
-
IRFZ34LPbF
SiHFZ34L-E3
Lead (Pb)-free
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
60
20
V
T
C = 25 °C
30
21
120
Continuous Drain Current
VGS at 10 V
ID
A
TC = 100 °C
Pulsed Drain Currenta, e
IDM
Linear Derating Factor
0.59
200
88
3.7
W/°C
mJ
Single Pulse Avalanche Energyb, e
EAS
PD
T
C = 25 °C
Maximum Power Dissipation
W
V/ns
°C
TA = 25 °C
Peak Diode Recovery dV/dtc, e
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
dV/dt
TJ, Tstg
4.5
- 55 to + 175
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, Starting TJ = 25 °C, L = 260 μH, Rg = 25 , IAS = 30 A (see fig. 12).
c. ISD 30 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
e. Uses IRFZ34, SiHFZ34 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 90368
S11-1045-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000