IRFR214, IRFU214, SiHFR214, SiHFU214
www.vishay.com
Vishay Siliconix
Power MOSFET
D
FEATURES
• Dynamic dV/dt rating
DPAK
(TO-252)
IPAK
(TO-251)
• Repetitive avalanche rated
• Surface-mount (IRFR214, SiHFR214)
• Straight lead (IRFU214, SiHFU214)
• Available in tape and reel
• Fast switching
• Ease of paralleling
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
D
D
G
Available
S
G
S
D
G
S
N-Channel MOSFET
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface-mount applications.
PRODUCT SUMMARY
VDS (V)
250
2.0
RDS(on) (Ω)
VGS = 10 V
Qg max. (nC)
8.2
Q
gs (nC)
gd (nC)
1.8
Q
4.5
Configuration
Single
ORDERING INFORMATION
PACKAGE
Lead (Pb)-free and
halogen-free
DPAK (TO-252)
SiHFR214-GE3
IRFR214PbF
DPAK (TO-252)
DPAK (TO-252)
SiHFR214TR-GE3
IRFR214TRPbF a
DPAK (TO-252)
IPAK (TO-251)
SiHFR214TRL-GE3
IRFR214TRLPbF a
SiHFR214TRR-GE3 SiHFU214-GE3
Lead (Pb)-free
IRFR214TRRPbF a
-
IRFU214PbF
-
Lead (Pb)-free and
halogen-free
IRFR214PbF-BE3 b IRFR214TRLPbF-BE3 ab IRFR214TRPbF-BE3 ab
Notes
a. See device orientation
b. “-BE3” denotes alternate manufacturing location
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
250
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
20
T
C = 25 °C
2.2
Continuous drain current
VGS at 10 V
ID
TC = 100 °C
1.4
A
Pulsed drain current a
IDM
8.8
Linear derating factor
0.20
0.020
190
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Repetitive avalanche current a
EAS
IAR
mJ
A
2.2
Repetitive avalanche energy a
EAR
2.5
mJ
W
Maximum power dissipation
T
C = 25 °C
PD
25
Maximum power dissipation (PCB mount) e
Peak diode recovery dV/dt c
TA = 25 °C
PD
2.5
W
dV/dt
TJ, Tstg
4.8
V/ns
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
-55 to +150
260
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, Starting TJ = 25 °C, L = 62 mH, Rg = 25 Ω, IAS = 2.2 A (see fig. 12)
c. ISD ≤ 2.2 A, dI/dt ≤ 65 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 Material)
S21-0771-Rev. F, 19-Jul-2021
Document Number: 91269
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000