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IRFR214TRLPBFA PDF预览

IRFR214TRLPBFA

更新时间: 2024-11-05 12:33:43
品牌 Logo 应用领域
科盛美 - KERSEMI /
页数 文件大小 规格书
7页 4263K
描述
Power MOSFET

IRFR214TRLPBFA 数据手册

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IRFR214, IRFU214, SiHFR214, SiHFU214  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
250  
Available  
• Repetitive Avalanche Rated  
RoHS*  
• Surface Mount (IRFR9210/SiHFR9210)  
COMPLIANT  
RDS(on) (Ω)  
VGS = 10 V  
2.0  
Qg (Max.) (nC)  
8.2  
1.8  
• Straight Lead (IRFU9210/SiHFU9210)  
• Available in Tape and Reel  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
4.5  
Configuration  
Single  
• Ease of Paralleling  
D
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D-PAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR214PbF  
SiHFR214-E3  
IRFR214  
DPAK (TO-252)  
IRFR214TRLPbFa  
SiHFR214TL-E3a  
DPAK (TO-252)  
IRFR214TRPbFa  
SiHFR214T-E3a  
IRFR214TRa  
DPAK (TO-252)  
IPAK (TO-251)  
IRFU214PbF  
SiHFU214-E3  
IRFU214  
-
Lead (Pb)-free  
-
-
-
IRFR214TRRa  
SiHFR214TRa  
SnPb  
SiHFR214  
SiHFR214Ta  
SiHFU214  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
250  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
2.2  
Continuous Drain Current  
VGS at 10 V  
ID  
1.4  
A
Pulsed Drain Currenta  
IDM  
8.8  
Linear Derating Factor  
0.20  
0.020  
190  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
mJ  
A
2.2  
Repetitive Avalanche Energya  
EAR  
2.5  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
25  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TA = 25 °C  
PD  
2.5  
W
dV/dt  
TJ, Tstg  
4.8  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
260d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, Starting TJ = 25 °C, L = 62 mH, RG = 25 Ω, IAS = 2.2 A (see fig. 12).  
c. ISD 2.2 A, dI/dt 65 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1” square PCB (FR-4 or G-10 Material).  
www.kersemi.com  
1

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