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IRFR220, IRFU220, SiHFR220, SiHFU220 PDF预览

IRFR220, IRFU220, SiHFR220, SiHFU220

更新时间: 2024-11-06 14:54:59
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威世 - VISHAY /
页数 文件大小 规格书
13页 809K
描述
Power MOSFET

IRFR220, IRFU220, SiHFR220, SiHFU220 数据手册

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IRFR220, IRFU220, SiHFR220, SiHFU220  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Dynamic dV/dt rating  
• Repetitive avalanche rated  
• Surface-mount (IRFR220, SiHFR220)  
• Straight lead (IRFU220, SiHFU220)  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
D
D
G
• Available in tape and reel  
Available  
• Fast switching  
• Ease of paralleling  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
S
S
G
D
S
G
N-Channel MOSFET  
DESCRIPTION  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
PRODUCT SUMMARY  
VDS (V)  
200  
0.80  
14  
RDS(on) (Ω)  
VGS = 10 V  
Qg max. (nC)  
Qgs (nC)  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU, SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface-mount applications.  
3.0  
Qgd (nC)  
7.9  
Configuration  
Single  
ORDERING INFORMATION  
PACKAGE  
DPAK (TO-252)  
SiHFR220-GE3  
IRFR220PbF  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
IPAK (TO-251)  
SiHFU220-GE3  
IRFU220PbF  
-
Lead (Pb)-free and  
halogen-free  
SiHFR220TRL-GE3  
IRFR220TRLPbF a  
-
-
Lead (Pb)-free  
IRFR220TRPbF a  
IRFR220TRRPbF a  
-
Lead (Pb)-free and  
halogen-free  
IRFR220PbF-BE3 b IRFR220TRLPbF-BE3 ab IRFR220TRPbF-BE3 ab  
Notes  
a. See device orientation  
b. “-BE3” denotes alternate manufacturing location  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
200  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
4.8  
Continuous drain current  
VGS at 10 V  
ID  
TC = 100 °C  
3.0  
A
Pulsed drain currenta  
IDM  
19  
Linear derating Factor  
0.33  
0.020  
161  
W/°C  
Linear derating Factor (PCB Mount) e  
Single pulse avalanche energy b  
Repetitive avalanche current a  
EAS  
IAR  
mJ  
A
4.8  
Repetitive avalanche energy a  
EAR  
4.2  
mJ  
Maximum power dissipation  
T
C = 25 °C  
42  
PD  
W
V/ns  
°C  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dV/dt c  
TA = 25 °C  
2.5  
dV/dt  
5.0  
Operating junction and storage temperaturerange  
Soldering recommendations (peak temperature) d  
TJ, Tstg  
-55 to +150  
260  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, Rg = 25 Ω, IAS = 4.8 A (see fig. 12)  
c. ISD 5.2 A, dI/dt 95 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
S21-0771-Rev. G, 19-Jul-2021  
Document Number: 91270  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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TRANSISTOR | MOSFET | N-CHANNEL | 200V V(BR)DSS | 5A I(D) | TO-252AA