IRFR214, IRFU214, SiHFR214, SiHFU214
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
250
Available
• Repetitive Avalanche Rated
RoHS*
• Surface Mount (IRFR9210/SiHFR9210)
COMPLIANT
RDS(on) (Ω)
VGS = 10 V
2.0
Qg (Max.) (nC)
8.2
1.8
• Straight Lead (IRFU9210/SiHFU9210)
• Available in Tape and Reel
• Fast Switching
Q
Q
gs (nC)
gd (nC)
4.5
Configuration
Single
• Ease of Paralleling
D
• Lead (Pb)-free Available
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The D-PAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR214PbF
SiHFR214-E3
IRFR214
DPAK (TO-252)
IRFR214TRLPbFa
SiHFR214TL-E3a
DPAK (TO-252)
IRFR214TRPbFa
SiHFR214T-E3a
IRFR214TRa
DPAK (TO-252)
IPAK (TO-251)
IRFU214PbF
SiHFU214-E3
IRFU214
-
Lead (Pb)-free
-
-
-
IRFR214TRRa
SiHFR214TRa
SnPb
SiHFR214
SiHFR214Ta
SiHFU214
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
250
20
V
VGS
TC = 25 °C
TC =100°C
2.2
Continuous Drain Current
VGS at 10 V
ID
1.4
A
Pulsed Drain Currenta
IDM
8.8
Linear Derating Factor
0.20
0.020
190
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
mJ
A
2.2
Repetitive Avalanche Energya
EAR
2.5
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
25
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TA = 25 °C
PD
2.5
W
dV/dt
TJ, Tstg
4.8
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
260d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, Starting TJ = 25 °C, L = 62 mH, RG = 25 Ω, IAS = 2.2 A (see fig. 12).
c. ISD ≤ 2.2 A, dI/dt ≤ 65 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1” square PCB (FR-4 or G-10 Material).
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