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IRFR214B PDF预览

IRFR214B

更新时间: 2024-11-24 22:51:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 648K
描述
250V N-Channel MOSFET

IRFR214B 数据手册

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November 2001  
IRFR214B / IRFU214B  
250V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switching DC/DC converters and  
switch mode power supplies.  
2.2A, 250V, R  
= 2.0@V = 10 V  
DS(on) GS  
Low gate charge ( typical 8.1 nC)  
Low Crss ( typical 7.5 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
G!  
I-PAK  
IRFU Series  
D-PAK  
IRFR Series  
G
S
G D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
IRFR214B / IRFU214B  
Units  
V
V
I
Drain-Source Voltage  
250  
2.2  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
1.4  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
8.5  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
45  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
2.2  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
2.5  
mJ  
V/ns  
W
AR  
dv/dt  
5.5  
Power Dissipation (T = 25°C) *  
2.5  
P
A
D
Power Dissipation (T = 25°C)  
25  
W
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.2  
W/°C  
°C  
T , T  
-55 to +150  
J
stg  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
5.08  
50  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2001 Fairchild Semiconductor Corporation  
Rev. B, November 2001  

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