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IRFPG30PBF PDF预览

IRFPG30PBF

更新时间: 2024-11-28 05:39:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1702K
描述
Power MOSFET

IRFPG30PBF 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:TO-247AC
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantFactory Lead Time:6 weeks
风险等级:0.75Is Samacsys:N
雪崩能效等级(Eas):180 mJ外壳连接:DRAIN
配置:SINGLE最小漏源击穿电压:1000 V
最大漏极电流 (Abs) (ID):3.1 A最大漏极电流 (ID):3.1 A
最大漏源导通电阻:5 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-247ACJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):125 W最大脉冲漏极电流 (IDM):12 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFPG30PBF 数据手册

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IRFPG30, SiHFPG30  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
1000  
Available  
• Repetitive Avalanche Rated  
RDS(on) (Ω)  
Qg (Max.) (nC)  
Qgs (nC)  
VGS = 10 V  
5.0  
RoHS*  
• Isolated Central Mounting Hole  
• Fast Switching  
COMPLIANT  
80  
10  
• Ease of Paralleling  
Q
gd (nC)  
42  
• Simple Drive Requirements  
• Lead (Pb)-free  
Configuration  
Single  
D
DESCRIPTION  
TO-247  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The TO-247 package is preferred for commercial-industrial  
applications where higher power levels preclude the use of  
TO-220 devices. The TO-247 is similar but superior to the  
earlier TO-218 package because of its isolated mounting  
hole. It also provides greater creepage distance between  
pins to meet the requirements of most safety specifications.  
S
D
G
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
TO-247  
IRFPG30PbF  
SiHFPG30-E3  
IRFPG30  
Lead (Pb)-free  
SnPb  
SiHFPG30  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
1000  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
T
C = 25 °C  
3.1  
Continuous Drain Current  
VGS at 10 V  
ID  
TC =100°C  
2.0  
A
Pulsed Drain Currenta  
IDM  
12  
Linear Derating Factor  
1.0  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
180  
3.1  
EAR  
13  
mJ  
W
Maximum Power Dissipation  
T
C = 25 °C  
PD  
125  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
1.0  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
10  
°C  
for 10 s  
6-32 or M3 screw  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 35 mH, RG = 25 Ω, IAS = 3.1 A (see fig. 12).  
c. ISD 3.1 A, dI/dt 80 A/µs, VDD 600, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91252  
S-81394-Rev. A, 21-Jul-08  
www.vishay.com  
1

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