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IRFL014NTRPBF PDF预览

IRFL014NTRPBF

更新时间: 2024-11-16 12:28:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关光电二极管局域网
页数 文件大小 规格书
8页 164K
描述
Advanced Process Technology

IRFL014NTRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE PACKAGE-4Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:0.65Is Samacsys:N
其他特性:AVALANCHE RATED, HIGH RELIABILITY外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):2.7 A最大漏极电流 (ID):1.9 A
最大漏源导通电阻:0.16 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-261AAJESD-30 代码:R-PDSO-G4
湿度敏感等级:1元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2.1 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFL014NTRPBF 数据手册

 浏览型号IRFL014NTRPBF的Datasheet PDF文件第2页浏览型号IRFL014NTRPBF的Datasheet PDF文件第3页浏览型号IRFL014NTRPBF的Datasheet PDF文件第4页浏览型号IRFL014NTRPBF的Datasheet PDF文件第5页浏览型号IRFL014NTRPBF的Datasheet PDF文件第6页浏览型号IRFL014NTRPBF的Datasheet PDF文件第7页 
PD- 95352  
IRFL014NPbF  
HEXFET® Power MOSFET  
l Surface Mount  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l Fast Switching  
l Fully Avalanche Rated  
l Lead-Free  
D
VDSS = 55V  
R
DS(on) = 0.16Ω  
G
ID = 1.9A  
S
Description  
Fifth Generation HEXFET MOSFETs from International  
®
Rectifierutilizeadvancedprocessingtechniquestoachieve  
extremelylow on-resistancepersiliconarea. Thisbenefit,  
combined with the fast switching speed and ruggedized  
®
device design that HEXFET power MOSFETs are well  
knownfor,providesthedesignerwithanextremelyefficient  
andreliabledeviceforuseinawidevarietyofapplications.  
The SOT-223 package is designed for surface-mount  
usingvaporphase,infrared,orwavesolderingtechniques.  
Its unique package design allows for easy automatic pick-  
and-place as with other SOT or SOIC packages but has  
the added advantage of improved thermal performance  
due to an enlarged tab for heatsinking. Power dissipation  
of 1.0W is possible in a typical surface mount application.  
SOT-223  
Absolute Maximum Ratings  
Parameter  
Max.  
2.7  
1.9  
1.5  
15  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V**  
Continuous Drain Current, VGS @ 10V*  
Continuous Drain Current, VGS @ 10V*  
Pulsed Drain Current   
A
PD @TA = 25°C  
PD @TA = 25°C  
Power Dissipation (PCB Mount)**  
Power Dissipation (PCB Mount)*  
Linear Derating Factor (PCB Mount)*  
Gate-to-Source Voltage  
2.1  
1.0  
8.3  
± 20  
48  
W
W
mW/°C  
V
VGS  
EAS  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
IAR  
1.7  
0.1  
5.0  
EAR  
Repetitive Avalanche Energy*  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
mJ  
V/ns  
°C  
dv/dt  
TJ, TSTG  
-55 to + 150  
Thermal Resistance  
Parameter  
Junction-to-Amb. (PCB Mount, steady state)*  
Junction-to-Amb. (PCB Mount, steady state)**  
Typ.  
90  
Max.  
120  
60  
Units  
RθJA  
RθJA  
°C/W  
50  
* When mounted on FR-4 board using minimum recommended footprint.  
** When mounted on 1 inch square copper board, for comparison with other SMD devices.  
www.irf.com  
1
06/07/04  

IRFL014NTRPBF 替代型号

型号 品牌 替代类型 描述 数据表
IRFL014NPBF INFINEON

类似代替

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Power MOSFET(Vdss=55V, Rds(on)=0.16ohm, Id=1.9A)

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