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IRF2804S-7P PDF预览

IRF2804S-7P

更新时间: 2024-10-29 22:48:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 263K
描述
AUTOMOTIVE MOSFET

IRF2804S-7P 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:D2PAK-7Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.28
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):1050 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:40 V最大漏极电流 (ID):160 A
最大漏源导通电阻:0.0016 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G6JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:6工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):225
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):1360 A
认证状态:Not Qualified表面贴装:YES
端子面层:TIN LEAD端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRF2804S-7P 数据手册

 浏览型号IRF2804S-7P的Datasheet PDF文件第2页浏览型号IRF2804S-7P的Datasheet PDF文件第3页浏览型号IRF2804S-7P的Datasheet PDF文件第4页浏览型号IRF2804S-7P的Datasheet PDF文件第5页浏览型号IRF2804S-7P的Datasheet PDF文件第6页浏览型号IRF2804S-7P的Datasheet PDF文件第7页 
PD - 96891  
AUTOMOTIVE MOSFET  
IRF2804S-7P  
HEXFET® Power MOSFET  
Features  
l
l
l
l
l
Advanced Process Technology  
D
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
VDSS = 40V  
G
Repetitive Avalanche Allowed up to Tjmax  
RDS(on) = 1.6mΩ  
S
Description  
ID = 160A  
S (Pin 2, 3 ,5,6,7)  
G (Pin 1)  
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistance per silicon area. Additional fea-  
tures of this design are a 175°C junction operat-  
ing temperature, fast switching speed and im-  
proved repetitive avalanche rating . These fea-  
tures combine to make this design an extremely  
efficient and reliable device for use in Automotive  
applications and a wide variety of other applica-  
tions.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
I
I
I
I
@ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
320  
A
D
D
D
@ TC = 100°C Continuous Drain Current, VGS @ 10V (See Fig. 9)  
230  
160  
@ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
1360  
330  
DM  
P
@TC = 25°C  
Maximum Power Dissipation  
W
D
Linear Derating Factor  
2.2  
W/°C  
V
V
Gate-to-Source Voltage  
± 20  
GS  
Single Pulse Avalanche Energy (Thermally Limited)  
EAS  
630  
1050  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
E
AS (tested)  
IAR  
EAR  
See Fig.12a,12b,15,16  
A
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
°C  
T
T
-55 to + 175  
J
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.50  
–––  
62  
Units  
°C/W  
Junction-to-Case  
RθJC  
RθCS  
RθJA  
RθJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
Junction-to-Ambient (PCB Mount, steady state)  
–––  
40  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
9/6/04  

IRF2804S-7P 替代型号

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