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IRF2805LPBF PDF预览

IRF2805LPBF

更新时间: 2024-02-25 01:57:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 306K
描述
HEXFET Power MOSFET

IRF2805LPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
风险等级:5.64Is Samacsys:N
峰值回流温度(摄氏度):NOT SPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

IRF2805LPBF 数据手册

 浏览型号IRF2805LPBF的Datasheet PDF文件第2页浏览型号IRF2805LPBF的Datasheet PDF文件第3页浏览型号IRF2805LPBF的Datasheet PDF文件第4页浏览型号IRF2805LPBF的Datasheet PDF文件第5页浏览型号IRF2805LPBF的Datasheet PDF文件第6页浏览型号IRF2805LPBF的Datasheet PDF文件第7页 
PD - 95944  
IRF2805SPbF  
IRF2805LPbF  
AUTOMOTIVE MOSFET  
Typical Applications  
l
l
l
l
l
ClimateControl  
ABS  
Electronic Braking  
WindshieldWipers  
Lead-Free  
HEXFET® Power MOSFET  
D
VDSS = 55V  
Features  
l
l
l
l
l
Advanced Process Technology  
R
DS(on) = 4.7mΩ  
G
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
ID = 135A†  
S
Repetitive Avalanche Allowed up to Tjmax  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisproduct area175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating . These features com-  
bine to make this design an extremely efficient and reliable  
deviceforuseinAutomotiveapplicationsandawidevariety  
of other applications.  
D2Pak  
IRF2805SPbF  
TO-262  
IRF2805LPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
135†  
96†  
700  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
PD @TC = 25°C  
Power Dissipation  
200  
W
W/°C  
V
Linear Derating Factor  
1.3  
VGS  
Gate-to-Source Voltage  
± 20  
380  
EAS  
Single Pulse Avalanche Energy‚  
Single Pulse Avalanche Energy Tested Valueˆ  
Avalanche Current  
mJ  
EAS (6 sigma)  
1220  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
2.0  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
Max.  
0.75  
40  
Units  
RθJC  
RθJA  
°C/W  
Junction-to-Ambient(PCB Mounted, steady state)**  
HEXFET(R) is a registered trademark of International Rectifier.  
www.irf.com  
1
11/16/04  

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