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IRF2807LPBF PDF预览

IRF2807LPBF

更新时间: 2024-12-01 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 269K
描述
HEXFET Power MOSFET

IRF2807LPBF 数据手册

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PD - 95945  
IRF2807SPbF  
IRF2807LPbF  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Lead-Free  
Description  
HEXFET® Power MOSFET  
D
VDSS = 75V  
RDS(on) = 13mΩ  
G
ID = 82A‡  
S
AdvancedHEXFET® PowerMOSFETsfromInternational  
Rectifierutilizeadvancedprocessingtechniquestoachieve  
extremelylowon-resistancepersiliconarea. Thisbenefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET power MOSFETs are well  
knownfor,providesthedesignerwithanextremelyefficient  
andreliabledeviceforuseinawidevarietyofapplications.  
The D2Pak is a surface mount power package capable of  
accommodatingdiesizesuptoHEX-4. Itprovidesthehighest  
powercapabilityandthelowestpossibleon-resistanceinany  
existing surface mount package. The D2Pak is suitable for  
highcurrentapplicationsbecauseofitslowinternalconnection  
resistance and can dissipate up to 2.0W in a typical surface  
mount application.  
D2Pak  
TO-262  
IRF2807SPbF  
IRF2807LPbF  
The through-hole version (IRF2807L) is available for low-  
profile applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
82‡  
58  
A
280  
PD @TC = 25°C  
Power Dissipation  
230  
W
W/°C  
V
Linear Derating Factor  
1.5  
VGS  
IAR  
Gate-to-Source Voltage  
± 20  
Avalanche Current  
43  
23  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
V/ns  
5.9  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
0.75  
Units  
RθJC  
RθJA  
°C/W  
Junction-to-Ambient (PCB mount)**  
–––  
40  
www.irf.com  
1
1/4/05  

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