PD - 95488A
IRF2807ZPbF
IRF2807ZSPbF
Features
IRF2807ZLPbF
Advanced Process Technology
HEXFET® Power MOSFET
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
D
VDSS = 75V
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
RDS(on) = 9.4mΩ
G
ID = 75A
Description
S
ThisHEXFET® PowerMOSFETutilizesthelatest
processing techniques to achieve extremely low
on-resistancepersiliconarea. Additionalfeatures
of this design are a 175°C junction operating
temperature, fast switching speed and improved
repetitive avalanche rating. These features
combinetomakethisdesignanextremelyefficient
and reliable device for use in a wide variety of
applications.
D2Pak
TO-262
TO-220AB
IRF2807ZPbF
IRF2807ZSPbF IRF2807ZLPbF
Absolute Maximum Ratings
Parameter
Max.
89
Units
A
I
I
I
I
@ TC = 25°C
@ TC = 100°C
@ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
D
D
D
63
Continuous Drain Current, VGS @ 10V (See Fig. 9)
75
(Package Limited)
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
350
170
DM
P
@TC = 25°C
Maximum Power Dissipation
W
D
Linear Derating Factor
Gate-to-Source Voltage
1.1
± 20
W/°C
V
V
GS
EAS
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
160
200
mJ
E
AS (tested)
Avalanche Current
IAR
EAR
See Fig.12a,12b,15,16
A
Repetitive Avalanche Energy
mJ
°C
T
J
Operating Junction and
-55 to + 175
T
Storage Temperature Range
STG
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Thermal Resistance
Parameter
Typ.
–––
Max.
0.90
–––
62
Units
°C/W
Rθ
Rθ
Rθ
Rθ
Junction-to-Case
JC
CS
JA
JA
Case-to-Sink, Flat, Greased Surface
0.50
–––
Junction-to-Ambient
–––
40
Junction-to-Ambient (PCB Mount, steady state)
HEXFET® is a registered trademark of International Rectifier.
www.irf.com
1
07/22/10