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IRF2805PBF PDF预览

IRF2805PBF

更新时间: 2024-11-30 22:40:59
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 163K
描述
AUTOMOTIVE MOSFET

IRF2805PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:0.87Samacsys Description:International Rectifier IRF2805PBF N-channel MOSFET Transistor, 75 A, 55 V, 4-Pin TO-220AB
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):1220 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (Abs) (ID):75 A
最大漏极电流 (ID):75 A最大漏源导通电阻:0.0047 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):330 W最大脉冲漏极电流 (IDM):700 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRF2805PBF 数据手册

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PD - 95493  
IRF2805PbF  
HEXFET® Power MOSFET  
AUTOMOTIVE MOSFET  
Typical Applications  
l
Climate Control, ABS, Electronic Braking,  
D
Windshield Wipers  
Lead-Free  
VDSS = 55V  
l
Features  
R
DS(on) = 4.7mΩ  
G
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
ID = 75A  
S
Repetitive Avalanche Allowed up to Tjmax  
Description  
SpecificallydesignedforAutomotiveapplications, thisHEXFET® Power  
MOSFET utilizes the latest processing techniques to achieve extremely  
lowon-resistancepersiliconarea. Additionalfeaturesofthisdesign are  
a 175°C junction operating temperature, fast switching speed and im-  
provedrepetitiveavalancherating.Thesefeaturescombinetomakethis  
design an extremely efficient and reliable device for use in Automotive  
applications and a wide variety of other applications.  
TO-220AB  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon limited)  
Continuous Drain Current, VGS @ 10V (See Fig.9)  
Continuous Drain Current, VGS @ 10V (Package limited)  
Pulsed Drain Current   
175  
120  
75  
A
700  
330  
2.2  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
Gate-to-Source Voltage  
± 20  
450  
1220  
EAS  
Single Pulse Avalanche Energy‚  
Single Pulse Avalanche Energy Tested Value‡  
Avalanche Current  
mJ  
EAS (6 sigma)  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
TJ  
Repetitive Avalanche Energy†  
Operating Junction and  
mJ  
-55 to + 175  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case )  
1.1 (10)  
N•m (lbf•in)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
0.45  
–––  
62  
Units  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
HEXFET(R) is a registered trademark of International Rectifier.  
www.irf.com  
1
07/01/04  

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