PD - 96891
AUTOMOTIVE MOSFET
IRF2804S-7P
HEXFET® Power MOSFET
Features
l
l
l
l
l
Advanced Process Technology
D
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
VDSS = 40V
G
Repetitive Avalanche Allowed up to Tjmax
RDS(on) = 1.6mΩ
S
Description
ID = 160A
S (Pin 2, 3 ,5,6,7)
G (Pin 1)
SpecificallydesignedforAutomotiveapplications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low
on-resistance per silicon area. Additional fea-
tures of this design are a 175°C junction operat-
ing temperature, fast switching speed and im-
proved repetitive avalanche rating . These fea-
tures combine to make this design an extremely
efficient and reliable device for use in Automotive
applications and a wide variety of other applica-
tions.
Absolute Maximum Ratings
Parameter
Max.
Units
I
I
I
I
@ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
320
A
D
D
D
@ TC = 100°C Continuous Drain Current, VGS @ 10V (See Fig. 9)
230
160
@ TC = 25°C
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
1360
330
DM
P
@TC = 25°C
Maximum Power Dissipation
W
D
Linear Derating Factor
2.2
W/°C
V
V
Gate-to-Source Voltage
± 20
GS
Single Pulse Avalanche Energy (Thermally Limited)
EAS
630
1050
mJ
Single Pulse Avalanche Energy Tested Value
Avalanche Current
E
AS (tested)
IAR
EAR
See Fig.12a,12b,15,16
A
Repetitive Avalanche Energy
Operating Junction and
mJ
°C
T
T
-55 to + 175
J
Storage Temperature Range
STG
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Thermal Resistance
Parameter
Typ.
–––
Max.
0.50
–––
62
Units
°C/W
Junction-to-Case
RθJC
RθCS
RθJA
RθJA
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
0.50
–––
Junction-to-Ambient (PCB Mount, steady state)
–––
40
HEXFET® is a registered trademark of International Rectifier.
www.irf.com
1
9/6/04