PD - 94428
IRF2805S
IRF2805L
AUTOMOTIVE MOSFET
Typical Applications
HEXFET® Power MOSFET
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ClimateControl
ABS
Electronic Braking
WindshieldWipers
D
VDSS = 55V
Features
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Advanced Process Technology
R
DS(on) = 4.7mΩ
UltraLowOn-Resistance
175°COperatingTemperature
Fast Switching
G
ID = 135A
S
Repetitive Avalanche Allowed up to Tjmax
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
siliconarea. Additionalfeaturesofthisproduct area175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating . These features com-
bine to make this design an extremely efficient and reliable
deviceforuseinAutomotiveapplicationsandawidevariety
of other applications.
D2Pak
IRF2805S
TO-262
IRF2805L
Absolute Maximum Ratings
Parameter
Max.
135
96
700
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
A
PD @TC = 25°C
Power Dissipation
200
W
W/°C
V
Linear Derating Factor
1.3
VGS
Gate-to-Source Voltage
± 20
380
EAS
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
EAS (6 sigma)
1220
IAR
See Fig.12a, 12b, 15, 16
A
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
2.0
V/ns
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
°C
300 (1.6mm from case )
Thermal Resistance
Parameter
Junction-to-Case
Typ.
–––
Max.
0.75
40
Units
RθJC
RθJA
°C/W
Junction-to-Ambient(PCB Mounted, steady state)**
–––
HEXFET(R) is a registered trademark of International Rectifier.
www.irf.com
1
06/10/02