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HGTP3N60A4 PDF预览

HGTP3N60A4

更新时间： 2024-09-16 22:14:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关双极性晶体管
页数 文件大小 规格书
8页 185K
描述
600V, SMPS Series N-Channel IGBT

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中文翻译

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HGTP3N60A4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Transferred零件包装代码：TO-220
包装说明：FLANGE MOUNT, R-PSFM-T3针数：3
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.29.00.95风险等级：5.21
其他特性：LOW CONDUCTION LOSS外壳连接：COLLECTOR
最大集电极电流 (IC)：17 A集电极-发射极最大电压：600 V
配置：SINGLE最大降落时间（tf）：100 ns
门极发射器阈值电压最大值：7 V门极-发射极最大电压：20 V
JEDEC-95代码：TO-220ABJESD-30 代码：R-PSFM-T3
JESD-609代码：e3元件数量：1
端子数量：3最高工作温度：150 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：FLANGE MOUNT峰值回流温度（摄氏度）：NOT SPECIFIED
极性/信道类型：N-CHANNEL最大功率耗散 (Abs)：70 W
认证状态：Not Qualified最大上升时间（tr）：15 ns
子类别：Insulated Gate BIP Transistors表面贴装：NO
端子面层：Matte Tin (Sn)端子形式：THROUGH-HOLE
端子位置：SINGLE处于峰值回流温度下的最长时间：NOT SPECIFIED
晶体管应用：POWER CONTROL晶体管元件材料：SILICON
标称断开时间 (toff)：180 ns标称接通时间 (ton)：17.5 ns
Base Number Matches：1

HGTP3N60A4 数据手册

 浏览型号HGTP3N60A4的Datasheet PDF文件第2页浏览型号HGTP3N60A4的Datasheet PDF文件第3页浏览型号HGTP3N60A4的Datasheet PDF文件第4页浏览型号HGTP3N60A4的Datasheet PDF文件第5页浏览型号HGTP3N60A4的Datasheet PDF文件第6页浏览型号HGTP3N60A4的Datasheet PDF文件第7页 
HGTD3N60A4S, HGTP3N60A4  
Data Sheet  
August 2003  
600V, SMPS Series N-Channel IGBT  
Features  
The HGTD3N60A4S and the HGTP3N60A4 are MOS gated  
high voltage switching devices combining the best features  
of MOSFETs and bipolar transistors. These devices have the  
high input impedance of a MOSFET and the low on-state  
conduction loss of a bipolar transistor. The much lower on-  
• >100kHz Operation at 390V, 3A  
• 200kHz Operation at 390V, 2.5A  
• 600V Switching SOA Capability  
o
• Typical Fall Time. . . . . . . . . . . . . . . . . 70ns at T = 125 C  
J
o
state voltage drop varies only moderately between 25 C and  
o
• 12mJ E Capability  
AS  
150 C.  
• Low Conduction Loss  
This IGBT is ideal for many high voltage switching  
applications operating at high frequencies where low  
conduction losses are essential. This device has been  
optimized for high frequency switch mode power  
supplies.  
• Related Literature  
- TB334 “Guidelines for Soldering Surface Mount  
Components to PC Boards”  
Formerly Developmental Type TA49327.  
Ordering Information  
Packaging  
JEDEC TO-252AA  
PART NUMBER  
HGTD3N60A4S  
HGTP3N60A4  
PACKAGE  
TO-252AA  
TO-220AB  
BRAND  
3N60A4  
3N60A4  
G
E
NOTE: When ordering, use the entire part number.  
COLLECTOR  
(FLANGE)  
Symbol  
C
JEDEC TO-220AB  
G
COLLECTOR  
(FLANGE)  
E
C
G
E
FAIRCHILD CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS  
4,364,073  
4,598,461  
4,682,195  
4,803,533  
4,888,627  
4,417,385  
4,605,948  
4,684,413  
4,809,045  
4,890,143  
4,430,792  
4,620,211  
4,694,313  
4,809,047  
4,901,127  
4,443,931  
4,631,564  
4,717,679  
4,810,665  
4,904,609  
4,466,176  
4,639,754  
4,743,952  
4,823,176  
4,933,740  
4,516,143  
4,639,762  
4,783,690  
4,837,606  
4,963,951  
4,532,534  
4,641,162  
4,794,432  
4,860,080  
4,969,027  
4,587,713  
4,644,637  
4,801,986  
4,883,767  
©2003 Fairchild Semiconductor Corporation  
HGTD3N60A4S, HGTP3N60A4 Rev. B1  
12345678

中文翻译

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