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H5MS5162DFR-L3M PDF预览

H5MS5162DFR-L3M

更新时间: 2024-11-01 07:02:35
品牌 Logo 应用领域
海力士 - HYNIX 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
62页 1317K
描述
512Mb (32Mx16bit) Mobile DDR SDRAM

H5MS5162DFR-L3M 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:VFBGA, BGA60,9X10,32
针数:60Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.28
风险等级:5.83Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:0.5 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):100 MHz
I/O 类型:COMMON交错的突发长度:2,4,8
JESD-30 代码:R-PBGA-B60JESD-609代码:e1
长度:10 mm内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:60字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-30 °C
组织:32MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA60,9X10,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH电源:1.8 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:1 mm自我刷新:YES
连续突发长度:2,4,8最大待机电流:0.00001 A
子类别:DRAMs最大压摆率:0.08 mA
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:8 mmBase Number Matches:1

H5MS5162DFR-L3M 数据手册

 浏览型号H5MS5162DFR-L3M的Datasheet PDF文件第2页浏览型号H5MS5162DFR-L3M的Datasheet PDF文件第3页浏览型号H5MS5162DFR-L3M的Datasheet PDF文件第4页浏览型号H5MS5162DFR-L3M的Datasheet PDF文件第5页浏览型号H5MS5162DFR-L3M的Datasheet PDF文件第6页浏览型号H5MS5162DFR-L3M的Datasheet PDF文件第7页 
512Mbit MOBILE DDR SDRAM based on 8M x 4Bank x16 I/O  
Specification of  
512Mb (32Mx16bit) Mobile DDR SDRAM  
Memory Cell Array  
- Organized as 4banks of 8,388,608 x16  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 1.3 / Apr. 2009  
1

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