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FQD3N50CTM PDF预览

FQD3N50CTM

更新时间: 2024-11-29 03:28:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 914K
描述
500V N-Channel MOSFET

FQD3N50CTM 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:DPAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.79
Is Samacsys:N雪崩能效等级(Eas):200 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):2.5 A
最大漏极电流 (ID):2.5 A最大漏源导通电阻:2.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):35 W
最大脉冲漏极电流 (IDM):10 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQD3N50CTM 数据手册

 浏览型号FQD3N50CTM的Datasheet PDF文件第2页浏览型号FQD3N50CTM的Datasheet PDF文件第3页浏览型号FQD3N50CTM的Datasheet PDF文件第4页浏览型号FQD3N50CTM的Datasheet PDF文件第5页浏览型号FQD3N50CTM的Datasheet PDF文件第6页浏览型号FQD3N50CTM的Datasheet PDF文件第7页 
March 2008  
®
QFET  
FQD3N50C / FQU3N50C  
500V N-Channel MOSFET  
Features  
Description  
2.5A, 500V, RDS(on) = 2.5@VGS = 10 V  
Low gate charge ( typical 10 nC)  
Low Crss ( typical 8.5pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies, active power factor  
correction, electronic lamp ballast based on half bridge  
topology.  
D
D
G
I-PAK  
FQU Series  
D-PAK  
FQD Series  
G
S
G D S  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
Units  
V
FQD3N50C/FQU3N50C  
VDSS  
ID  
Drain-Source Voltage  
500  
2.5  
Drain Current  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
A
1.5  
A
(Note 1)  
IDM  
Drain Current  
10  
A
VGSS  
EAS  
IAR  
Gate-Source Voltage  
± 30  
200  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
2.5  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25°C)  
3.5  
mJ  
V/ns  
W
4.5  
35  
- Derate above 25°C  
0.28  
-55 to +150  
W/°C  
°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
Max  
3.5  
Units  
°C/W  
°C/W  
°C/W  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient*  
Thermal Resistance, Junction-to-Ambient  
--  
--  
--  
50  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2008 Fairchild Semiconductor Corporation  
FQD3N50C / FQU3N50C Rev. B  
1
www.fairchildsemi.com  

FQD3N50CTM 替代型号

型号 品牌 替代类型 描述 数据表
FQD3N50CTF FAIRCHILD

完全替代

500V N-Channel MOSFET

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