DATA SHEET
www.onsemi.com
MOSFET – Dual, P-Channel,
Common Drain,
POWERTRENCH)
V
r
MAX
I
MAX
S1S2
S1S2(on)
S1S2
−20 V
36 mW @ −4.5 V
50 mW @ −2.5 V
−7 A
-20 V, -7 A, 36 mW
Pin 1
S1 S1 G1
D1/D2
Pin 1
FDMB2308PZ
General Description
This device is designed specifically as a single package solution for
Li−Ion battery pack protection circuit and other ultra−portable
applications. It features two common drain P−channel MOSFETs,
which enables bidirectional current flow, on onsemi’s advanced
POWERTRENCH process with state of the art MircoFETt
Leadframe, the FDMB2308PZ minimizes both PCB space and
S2 S2 G2
Bottom
Top
WDFN6 2x3, 0.65P
CASE 511CX
r
.
S1S2(on)
Features
• Max r
= 36 mW at V = −4.5 V, I = −5.7 A
GS D
S1S2(on)
• Max r
= 50 mW at V = −2.5 V, I = −4.6 A
GS D
MARKING DIAGRAM
S1S2(on)
• Low Profile − 0.8 mm Maximum − in the New Package MicroFET
2x3 mm
&Z&2&K
308
• HBM ESD Protection Level > 2.8 kV (Note 3)
• This Device is Pb−Free, Halide Free and is RoHS Compliant
Applications
&Z = Assembly Plant Code
&2 = 2−Digit Date Code
• Li−Ion Battery Pack
&K = 2−Digits Lot Run Traceability Code
308 = Specific Device Code
MOSFET MAXIMUM RATINGS (T = 25°C, unless otherwise noted)
A
Symbol
Parameter
Source1 to Source2 Voltage
Gate to Source Voltage
Ratings
−20
Unit
V
V
S1S2
V
GS
12
V
PIN ASSIGNMENT
I
Source1 to Source2 Current
A
S1S2
−Continuous T = 25°C (Note 1a)
−7
−30
A
−Pulsed
G2
S2
S2
4
5
6
3
2
1
G1
S1
S1
P
Power Dissipation
W
D
T = 25°C (Note 1a)
2.2
0.8
A
T = 25°C (Note 1b)
A
T , T
Operating and Storage Junction
Temperature Range
−55 to +150
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (T = 25°C, unless otherwise noted)
A
ORDERING INFORMATION
Symbol
Parameter
Ratings
Unit
See detailed ordering and shipping information on page 5 of
this data sheet.
R
q
JA
Thermal Resistance, Junction to Ambient
(Note 1a)
57
°C/W
R
q
JA
Thermal Resistance, Junction to Ambient
(Note 1b)
161
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
March, 2023 − Rev. 3
FDMB2308PZ/D