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FDMB3800N PDF预览

FDMB3800N

更新时间: 2024-10-29 11:14:23
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
7页 210K
描述
双 N 沟道,PowerTrench® MOSFET,30V,4.8A,40mΩ

FDMB3800N 技术参数

是否无铅:不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-N8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:1 week风险等级:0.96
Is Samacsys:N配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):4.8 A
最大漏极电流 (ID):4.8 A最大漏源导通电阻:40 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):60 pF
JESD-30 代码:R-PDSO-N8JESD-609代码:e4
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):1.6 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMB3800N 数据手册

 浏览型号FDMB3800N的Datasheet PDF文件第2页浏览型号FDMB3800N的Datasheet PDF文件第3页浏览型号FDMB3800N的Datasheet PDF文件第4页浏览型号FDMB3800N的Datasheet PDF文件第5页浏览型号FDMB3800N的Datasheet PDF文件第6页浏览型号FDMB3800N的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – Dual, N-Channel,  
POWERTRENCH)  
V
r
MAX  
I MAX  
D
DS  
DS(on)  
30 V  
40 mW @ 4.8 V  
51 mW @ 4.3 V  
4.8 A  
30 V, 4.8 A, 40 mW  
FDMB3800N  
General Description  
These N−Channel Logic Level MOSFETs are produced using  
onsemi’s advanced POWERTRENCH process that has been  
especially tailored to minimize the on−state resistance and yet  
maintain superior switching performance.  
These devices are well suited for low voltage and battery powered  
applications where low in−line power loss and fast switching are  
required.  
WDFN8 3x1.9, 0.65P  
(MicroFET 3x1.9)  
CASE 511CW  
Features  
MARKING DIAGRAM  
Max r  
Max r  
= 40 mW at V = 10 V, I = 4.8 A  
GS D  
DS(on)  
DS(on)  
= 51 mW at V = 4.5 V, I = 4.3 A  
GS  
D
$Y&Z&2&K  
3800  
Fast Switching Speed  
Low Gate Charge  
High Performance Trench Technology for Extremely Low r  
High Power and Current Handling Capability  
DS(on)  
$Y = Logo  
&Z = Assembly Plant Code  
&2 = 2−Digit Date Code  
&K = 2−Digits Lot Run Traceability Code  
3800 = Specific Device Code  
This Device is Pb−Free, Halide Free and is RoHS Compliant  
MOSFET MAXIMUM RATINGS (T = 25°C, unless otherwise noted)  
A
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
Ratings  
30  
Unit  
V
V
DS  
GS  
PIN ASSIGNMENT  
V
20  
V
Q2  
I
D
A
D2  
D2  
D1  
D1  
5
6
7
8
4
3
2
1
G2  
S2  
G1  
S1  
− Continuous T = 25°C (Note 1a)  
4.8  
9
A
− Pulsed  
Q1  
P
Power Dissipation  
W
D
T = 25°C (Note 1a)  
1.6  
0.75  
A
T = 25°C (Note 1b)  
A
T , T  
Operating and Storage Junction  
Temperature Range  
−55 to +150  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
THERMAL CHARACTERISTICS (T = 25°C, unless otherwise noted)  
A
Symbol  
Parameter  
Ratings  
Unit  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
80  
°C/W  
R
q
q
JA  
R
Thermal Resistance, Junction to Ambient  
(Note 1b)  
165  
JA  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
March, 2023 − Rev. 4  
FDMB3800N/D  

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