DATA SHEET
www.onsemi.com
MOSFET – Dual, N-Channel,
POWERTRENCH)
Bottom
D1
D1
D1
V
IN
G
V
Pin 1
IN
D1
Q1: 30 V, 11.6 mW; Q2: 30 V, 6.4 mW
V
HS
IN
G1
G
V
IN
FDMC007N30D
General Description
S2
GND
GND
GND
LS
S2
S2
G2
This device includes two specialized N−Channel MOSFETs in
a dual Power33 (3mm × 3mm MLP) package. The switch node has
been internally connected to enable easy placement and routing of
synchronous buck converters. The control MOSFET (Q1) and
synchronous MOSFET (Q2) have been designed to provide optimal
power efficiency.
WDFN8 3x3
(Power 33)
CASE 511DE
G1
D1
D1
D1
G2
S2
S2
S2
Features
Q1: N−Channel
• Max R
• Max R
= 11.6 mꢀ at V = 10 V, I = 10 A
GS D
DS(on)
= 13.3 mꢀ at V = 4.5 V, I = 9 A
DS(on)
GS
D
Q1: N−Channel
• Max R
= 6.4 mꢀ at V = 10 V, I = 16 A
GS D
= 7.0 mꢀ at V = 4.5 V, I = 15 A
GS D
DS(on)
• Max R
DS(on)
• RoHS Compliant
Dual N-Channel MOSFET
MARKING DIAGRAM
Applications
• Mobile Computing
• Mobile Internet Devices
• General Purpose Point of Load
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
&Z&2&K
FDMC
7N30D
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage (Note 4)
Drain Current:
Q1
30
12
Q2
30
12
Unit
V
V
DS
V
GS
V
I
D
A
− Continuous, T = 25°C
29
18
10
46
29
16
C
&Z
&2
&K
= Assembly Plant Code
(Note 6)
= Data Code (Year & Week)
= Lot Traceability Code
= Specific Device Code
− Continuous, T = 100°C
C
(Note 6)
FDMC7N30D
− Continuous, T = 25°C
A
(Note 1a)
(Note 1a) (Note 1b)
− Pulsed (Note 5)
113
302
E
Single Pulse Avalanche
Energy (Note 3)
24
54
mJ
W
AS
ORDERING INFORMATION
†
P
Power Dissipation for Single
Operation:
T = 25°C
A
Device
Package
Shipping
D
FDMC007N30D
WDFN−8
3000 /
1.9
2.5
(Note 1a) (Note 1b)
(Power 33)
Tape & Reel
T = 25°C
A
0.7
1.0
(Note 1c) (Note 1d)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
T , T
Operating and Storage Junction
Temperature Range
−55 to +150
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
April, 2023 − Rev. 3
FDMC007N30D/D