DATA SHEET
www.onsemi.com
MOSFET – Single, P-Channel,
POWERTRENCH)
V
r
MAX
I MAX
D
DS
DS(on)
−20 V
20 mW @ −4.5 V
24 mW @ −2.5 V
34 mW @ −1.8 V
−9.4 A
-20 V, -9.4 A, 20 mW
FDMA910PZ
Pin 1
Drain
D
D
G
General Description
Source
This device is designed specifically for battery charge or load
switching in cellular handset and other ultraportable applications. It
features a MOSFET with low on−state resistance and zener diode
protection against ESD. The MicroFETt 2x2 package offers
exceptional thermal performance for its physical size and is well
suited to linear mode applications.
D
D
S
Features
Bottom
• Max r
• Max r
• Max r
= 20 mW at V = −4.5 V, I = −9.4 A
GS D
DS(on)
DS(on)
DS(on)
WDFN6 2x2, 0.65P
(MicroFET 2x2)
CASE 511CZ
= 24 mW at V = −2.5 V, I = −8.6 A
GS
D
= 34 mW at V = −1.8 V, I = −7.2 A
GS
D
• Low Profile − 0.8 mm Maximum in the New Package MicroFET
2x2 mm
MARKING DIAGRAM
• HBM ESD Protection Level > 2.8 kV Typical (Note 3)
• Free from Halogenated Compounds and Antimony Oxides
• This Device is Pb−Free, Halide Free and is RoHS Compliant
&Z&2&K
910
MOSFET MAXIMUM RATINGS (T = 25°C, unless otherwise noted)
A
&Z = Assembly Plant Code
&2 = 2−Digit Date Code
&K = 2−Digits Lot Run Traceability Code
910 = Specific Device Code
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Ratings
Unit
V
V
−20
8
DS
GS
V
V
I
D
− Continuous T = 25°C (Note 1a)
−9.4
−45
A
A
− Pulsed
PIN ASSIGNMENT
P
D
Power Dissipation
W
T = 25°C (Note 1a)
A
2.4
0.9
A
Bottom Drain Contact
T = 25°C (Note 1b)
D
D
G
1
2
3
6
5
4
D
D
S
T , T
Operating and Storage Junction
Temperature Range
−55 to +150
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (T = 25°C, unless otherwise noted)
A
Symbol
Parameter
Ratings
Unit
Thermal Resistance, Junction to Ambient
(Note 1a)
52
°C/W
R
q
q
JA
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
R
Thermal Resistance, Junction to Ambient
(Note 1b)
145
JA
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
March, 2023 − Rev. 3
FDMA910PZ/D