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FDMA8884 PDF预览

FDMA8884

更新时间: 2024-10-29 11:12:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 383K
描述
30V单N沟道PowerTrench® MOSFET

FDMA8884 数据手册

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May 2014  
FDMA8884  
Single N-Channel Power Trench® MOSFET  
30 V, 6.5 A, 23 mΩ  
Features  
General Description  
„ Max rDS(on) = 23 mΩ at VGS = 10 V, ID = 6.5 A  
„ Max rDS(on) = 30 mΩ at VGS = 4.5 V, ID = 6.0 A  
„ High performance trench technology for extremely low rDS(on)  
„ Fast switching speed  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor‘s advanced Power Trench® process that has  
been optimized for rDS(on) switching performance.  
Application  
„ RoHS Compliant  
„ Primary Switch  
Pin 1  
G
D
D
Bottom Drain Contact  
D
D
S
D
D
Drain  
Source  
G
D
D
S
MicroFET 2X2 (Bottom View)  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
±20  
V
V
(Note 3)  
Drain Current -Continuous (Package limited) TC = 25 °C  
8.0  
ID  
-Continuous  
-Pulsed  
TA = 25 °C  
(Note 1a)  
6.5  
A
25  
Power Dissipation  
Power Dissipation  
Operating and Storage Junction Temperature Range  
(Note 1a)  
(Note 1b)  
1.9  
PD  
W
0.7  
TJ, TSTG  
-55 to +150  
°C  
Thermal Characteristics  
RθJA  
RθJA  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
(Note 1b)  
65  
°C/W  
180  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
7 ’’  
Tape Width  
8 mm  
Quantity  
884  
FDMA8884  
MicroFET 2x2  
3000 units  
©2012 Fairchild Semiconductor Corporation  
FDMA8884 Rev.C5  
1
www.fairchildsemi.com  

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