EFA120A
Excelics
DATA SHEET
Low Distortion GaAs Power FET
670
•
•
•
+28.0dBm TYPICAL OUTPUT POWER
9.5dB TYPICAL POWER GAIN AT 12GHz
0.3 X 1200 MICRON RECESSED
“MUSHROOM” GATE
116
50
D
48
D
G
D
G
•
•
Si3N4 PASSIVATION
340
100
ADVANCED EPITAXIAL DOPING PROFILE
PROVIDES HIGH POWER EFFICIENCY,
LINEARITY AND RELIABILITY
Idss SORTED IN 20mA PER BIN RANGE
G
40
S
S
S
S
•
50
95
80
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
P1dB
PARAMETERS/TEST CONDITIONS
MIN TYP MAX UNIT
Output Power at 1dB Compression
Vds=8V, Ids=50% Idss
f=12GHz
f=18GHz
26.0
28.0
28.0
9.5
dBm
dB
Gain at 1dB Compression
Vds=8V, Ids=50% Idss
f=12GHz
f=18GHz
8.0
G1dB
PAE
7.0
Power Added Efficiency at 1dB Compression
%
Vds=8V, Ids=50% Idss
f=12GHz
34
Idss
Gm
Saturated Drain Current Vds=3V, Vgs=0V
200
140
340
440
-3.5
mA
mS
V
Transconductance
Pinch-off Voltage
Vds=3V, Vgs=0V
180
-2.0
-15
-14
37
Vp
Vds=3V, Ids=3.0mA
BVgd
BVgs
Rth
Drain Breakdown Voltage Igd=1.2mA
Source Breakdown Voltage Igs=1.2mA
Thermal Resistance (Au-Sn Eutectic Attach)
-12
-7
V
V
oC/W
MAXIMUM RATINGS AT 25OC
SYMBOLS
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Drain Current
ABSOLUTE1
12V
CONTINUOUS2
8V
Vds
Vgs
Ids
-8V
-4V
Idss
385mA
Igsf
Pin
Tch
Tstg
Pt
Forward Gate Current
Input Power
30mA
5mA
26dBm
175oC
-65/175oC
@ 3dB Compression
150oC
-65/150oC
Channel Temperature
Storage Temperature
Total Power Dissipation
3.7 W
3.1 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com