Excelics
EFB025A
PRELIMINARY DATA SHEET
General Purpose GaAs FET
420
104
·
·
·
+18.5dBm TYPICAL OUTPUT POWER
11.0dB TYPICAL POWER GAIN AT 12GHz
TYPICAL 1.3 dB NOISE FIGURE AND 11 dB ASSOCIATED
GAIN AT 12GHz
50
D
D
48
90
260
·
·
·
0.3 X 250 MICRON RECESSED “MUSHROOM” GATE
Si3N4 PASSIVATION
ADVANCED EPITAXIAL DOPING PROFILE
PROVIDES HIGH POWER EFFICIENCY,
LINEARITY AND RELIABILITY
S
S
G
G
40
59
78
50
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
·
Idss SORTED IN 5mA PER BIN RANGE
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
PARAMETERS/TEST CONDITIONS
MIN
TYP
18.5
18.5
11
MAX
UNIT
Output Power at 1dB Compression
f=12GHz
f=18GHz
f=12GHz
f=18GHz
17
dBm
P1dB
Vds=6V, Ids=50% Idss
Gain at 1dB Compression
Vds=6V, Ids=50% Idss
9
dB
G1dB
9
Noise Figure Vds=3V,Ids=15mA
Associated Gain Vds=3V,Ids=15mA
f=12GHz
f=12GHz
1.3
11
dB
dB
mA
mS
V
NF
GA
Saturated Drain Current Vds=3V, Vgs=0V
35
40
65
105
-3.0
Idss
Gm
Transconductance
Pinch-off Voltage
Vds=3V, Vgs=0V
60
Vds=3V, Ids=1.0mA
-1.5
-8.5
-8.5
155
Vp
Drain Breakdown Voltage Igd=100uA
Source Breakdown Voltage Igs=100uA
Thermal Resistance (Au-Sn Eutectic Attach)
-5.5
-5.5
V
BVgd
BVgs
Rth
V
oC/W
MAXIMUM RATINGS AT 25OC
SYMBOLS
PARAMETERS
ABSOLUTE1
CONTINUOUS2
Drain-Source Voltage
Gate-Source Voltage
Drain Current
10V
-6V
Idss
6V
Vds
Vgs
Ids
-4V
Idss
Forward Gate Current
Input Power
6mA
1mA
Igsf
Pin
Tch
Tstg
Pt
16dBm
175oC
-65/175oC
@ 3dB Compression
150oC
-65/150oC
Channel Temperature
Storage Temperature
Total Power Dissipation
880mW
730mW
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com