EFA160A
Excelics
DATA SHEET
Low Distortion GaAs Power FET
•
•
•
+29.0dBm TYPICAL OUTPUT POWER
9.0dB TYPICAL POWER GAIN AT 12GHz
0.3 X 1600 MICRON RECESSED
“MUSHROOM” GATE
840
116
50
D
48
D
G
D
G
D
G
•
•
Si3N4 PASSIVATION
340
100
ADVANCED EPITAXIAL DOPING PROFILE
PROVIDES HIGH POWER EFFICIENCY,
LINEARITY AND RELIABILITY
Idss SORTED IN 30mA PER BIN RANGE
G
40
S
S
S
S
S
•
95
80
50
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
P1dB
PARAMETERS/TEST CONDITIONS
MIN TYP MAX UNIT
Output Power at 1dB Compression
Vds=8V, Ids=50% Idss
Gain at 1dB Compression
Vds=8V, Ids=50% Idss
f=12GHz
27.0
29.0
29.0
9.0
dBm
dB
f=18GHz
f=12GHz
f=18GHz
7.0
G1dB
PAE
6.5
Gain at 1dB Compression
Vds=8V, Ids=50% Idss
%
f=12GHz
34
Idss
Gm
Saturated Drain Current Vds=3V, Vgs=0V
260
180
420
600
-3.5
mA
mS
V
Transconductance
Pinch-off Voltage
Vds=3V, Vgs=0V
240
-2.0
-15
-14
30
Vp
Vds=3V, Ids=4.0mA
BVgd
BVgs
Rth
Drain Breakdown Voltage Igd=1.6mA
Source Breakdown Voltage Igs=1.6mA
Thermal Resistance (Au-Sn Eutectic Attach)
-12
-7
V
V
oC/W
MAXIMUM RATINGS AT 25OC
SYMBOLS
PARAMETERS
ABSOLUTE1
CONTINUOUS2
Vds
Vgs
Ids
Drain-Source Voltage
Gate-Source Voltage
Drain Current
12V
8V
-8V
-4V
Idss
475mA
Igsf
Pin
Tch
Tstg
Pt
Forward Gate Current
Input Power
40mA
28dBm
175oC
-65/175oC
4.5W
7mA
@ 3dB Compression
150oC
-65/150oC
Channel Temperature
Storage Temperature
Total Power Dissipation
3.8W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com