EFA240BV-100P
ISSUED 09/28/2007
Low Distortion GaAs Power FET
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NON-HERMETIC 100MIL METAL FLANGE PACKAGE
+31.0dBm TYPICAL OUTPUT POWER
8.5dB TYPICAL POWER GAIN AT 12GHz
0.3 X 2400 MICRON RECESSED “MUSHROOM” GATE
Si3N4 PASSIVATION
ADVANCED EPITAXIAL DOPING PROFILE
PROVIDES HIGH POWER EFFICIENCY,
LINEARITY AND RELIABILITY
G
D
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
PARAMETERS/TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output Power at 1dB Compression
VDS=8V, IDS=50% IDSS
f= 12GHz
f= 18GHz
29.0
31.0
31.0
8.5
dBm
P1dB
Gain at 1dB Compression
VDS=8V, IDS=50% IDSS
Power Added Efficiency at 1dB Compression
f= 12GHz
f= 18GHz
7
dB
%
G1dB
PAE
6.0
33
VDS=8V, IDS=50% IDSS
Saturated Drain Current
Transconductance
f=12GHz
400
280
680
360
-2.0
-15
-14
15
880
-3.5
mA
mS
V
IDSS
Gm
VDS=3V, VGS=0V
VDS=3V, VGS=0V
VDS=3V,IDS=6mA
IGD=2.4mA
Vp
Pinch-off Voltage
-13
-7
V
BVGD
BVGS
Rth
Drain Breakdown Voltage
Source Breakdown Voltage
V
IGS=2.4mA
ºC/W
Thermal Resistance (Au-Sn Eutectic Attach)
Note: * Overall Rth depends on case mounting.
MAXIMUM RATINGS AT 25OC
SYMBOLS
VDS
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Forward Gate Current
Reverse Gate Current
Input Power
ABSOLUTE1
12V
CONTINUOUS2
8V
VGS
-8V
-4V
Igf
60 mA
10 mA
Igr
-1.8 mA
29 dBm
175oC
-0.6 mA
Pin
@ 3dB Compression
175oC
Tch
Tstg
Pt
Channel Temperature
Storage Temperature
Total Power Dissipation
-65/175oC
-65/175oC
9.1 W
7.6 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
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Revised September 2007