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BSP170PH6327XTSA1 PDF预览

BSP170PH6327XTSA1

更新时间: 2024-11-09 15:45:43
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网PC脉冲光电二极管晶体管
页数 文件大小 规格书
9页 574K
描述
Power Field-Effect Transistor, 1.9A I(D), 60V, 0.3ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4

BSP170PH6327XTSA1 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-G4
针数:4Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:10 weeks风险等级:1.61
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:833995Samacsys Pin Count:4
Samacsys Part Category:MOSFET (P-Channel)Samacsys Package Category:SOT223 (3-Pin)
Samacsys Footprint Name:SOT-223Samacsys Released Date:2020-01-13 09:37:42
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):70 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):1.9 A最大漏极电流 (ID):1.9 A
最大漏源导通电阻:0.3 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G4JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.8 W最大脉冲漏极电流 (IDM):7.6 A
参考标准:AEC-Q101子类别:Other Transistors
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

BSP170PH6327XTSA1 数据手册

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BSP170P  
SIPMOS® Small-Signal-Transistor  
Product Summary  
Features  
V DS  
-60  
0.3  
V
A
• P-Channel  
R DS(on),max  
I D  
• Enhancement mode  
-1.9  
• Avalanche rated  
• dv /dt rated  
PG-SOT223  
• Pb-free lead plating; RoHS compliant  
• Qualified according to AEC Q101  
Halogen­free according to IEC61249­2­21  
Type  
BSP170P  
Package  
Tape and reel information  
Marking Lead free  
BSP170P Yes  
Packing  
PG-SOT223  
H6327: 1000pcs/reel  
Non Dry  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
steady state  
I D  
T A=25 °C  
-1.9  
-1.5  
-7.6  
70  
Continuous drain current  
A
T A=70 °C  
I D,pulse  
E AS  
T A=25 °C  
Pulsed drain current  
I D=1.9 A, R GS=25  
Avalanche energy, single pulse  
mJ  
Avalanche energy, periodic limited by  
Tjmax  
E AR  
0.18  
I D=1.9 A, V DS=48 V,  
di /dt =-200 A/µs,  
-6  
Reverse diode dv /dt  
dv /dt  
kV/µs  
T
j,max=150 °C  
V GS  
±20  
1.8  
Gate source voltage  
V
P tot  
T A=25 °C  
Power dissipation  
W
°C  
T j, T stg  
-55 ... 150  
1A (250V to 500V)  
260 °C  
Operating and storage temperature  
ESD class  
JESD22-C101 (HBM)  
Soldering temperature  
IEC climatic category; DIN IEC 68-1  
55/150/56  
Rev 2.53  
page 1  
2012-11-26  

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